Magnetic Shielding in Build-Up Packaging for MEMS Interference
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Solution Overview
Problem
Magnetic fields generated by one device in a package can detrimentally impact other devices, particularly when both are embedded in the same build-up packaging, leading to interference and reduced performance.
Innovation Solution
Integration of magnetic field shielding materials with high relative permeability, such as permalloy or Mu-metal, into the packaging build-up to confine or restrict magnetic fields within the package, using techniques like bottom-side, top-side, and lateral field shielding to minimize exposure to neighboring devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If magnetic field shielding materials are integrated into the packaging build-up, then magnetic field exposure to devices outside the magnet region is reduced, but device complexity increases
Solution Approach 1:
The magnetic field shielding materials are integrated directly into the packaging build-up structure, merging the shielding function with the existing packaging layers. This combination approach reduces the need for separate shielding components and minimizes additional complexity while effectively containing magnetic fields within the magnet region.
Solution Approach 2:
Magnetic field shielding materials with high relative permeability (such as permalloy or Mu-metal) are introduced as intermediary elements between the magnet and other devices. These materials act as mediators that redirect and contain magnetic field lines, preventing them from interfering with neighboring devices while maintaining the overall packaging integrity.
2Measurement precision
If magnetic field shielding is implemented to protect other devices, then magnetic MEMS device sensitivity is enhanced, but manufacturing complexity increases
Solution Approach 1:
The magnetic field shielding materials are incorporated into the packaging build-up during the manufacturing process, performing the shielding function in advance before the magnetic MEMS devices are fully assembled. This preliminary integration ensures optimal magnetic field containment and device sensitivity from the outset, while allowing for systematic manufacturing planning.
Solution Approach 2:
The solution utilizes materials with specific parameter characteristics (high relative permeability) to achieve effective magnetic field shielding. By selecting materials with appropriate magnetic properties and integrating them at specific locations in the packaging build-up, the system enhances magnetic MEMS sensitivity while managing manufacturing complexity through parameter-based material selection.
3Object-generated harmful factors
If magnetic fields are confined within the magnet region, then interference with neighboring devices is reduced, but the packaging structure becomes more complex
Solution Approach 1:
The shielding function is merged with the existing packaging build-up structure by integrating magnetic field shielding materials into the alternating layers of patterned conductive and insulating materials. This merging approach contains magnetic interference within the magnet region while avoiding the need for separate, complex shielding structures.
Solution Approach 2:
Magnetic field shielding materials are strategically placed in specific regions of the packaging build-up where magnetic field containment is most needed. This localized approach allows for effective interference reduction with minimal additional complexity, as shielding is applied only where required rather than throughout the entire package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces magnetic field exposure to non-MEMS devices within the package while maintaining or enhancing the magnetic field strength and sensitivity for MEMS devices, thereby improving the performance and protection of both types of devices.
Implementation Method 1
magnetic field shielding materials with high relative permeability, such as permalloy or Mu-metal, into the packaging build-up to confine or restrict magnetic fields within the package
Implementation Method 2
magnetic field shielding materials with high relative permeability, such as permalloy or Mu-metal
Implementation Method 3
to confine or restrict magnetic fields within the package, using techniques like bottom-side, top-side, and lateral field shielding to minimize exposure to neighboring devices
Data Source
AI summary
Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure.