Multilayer Magnetic Shielding for Electronic Device EMI
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Solution Overview
Problem
Existing electronic devices face challenges in stabilizing operations due to unattenuated electromagnetic waves emitted by semiconductor elements, which can interfere with the device's functionality and reliability.
Innovation Solution
The electronic device incorporates a layered structure comprising multiple nonmagnetic and magnetic layers, where the magnetic layers are strategically positioned between nonmagnetic layers to effectively attenuate electromagnetic waves, enhancing shielding efficiency and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield layer is added to attenuate electromagnetic waves, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple functional layers (magnetic layers and nonmagnetic layers) into a single integrated shield layer structure. The magnetic layers and nonmagnetic layers are formed as a unified multilayer configuration that simultaneously provides electromagnetic wave attenuation and structural integrity, rather than adding separate independent shielding components.
Solution Approach 2:
The patent employs composite material structure consisting of alternating magnetic layers and nonmagnetic layers. This composite configuration leverages the complementary properties of magnetic materials (for magnetic field attenuation) and nonmagnetic materials (for structural support and electrical properties), achieving superior electromagnetic interference shielding while maintaining manageable device complexity.
2Reliability
If multiple layers are used to improve shielding efficiency, then electromagnetic wave attenuation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the shield layer into multiple discrete magnetic layers and nonmagnetic layers, each with specific thicknesses and material compositions. This segmentation allows for optimized electromagnetic attenuation at different frequencies and directions, while each layer can be independently controlled during manufacturing processes.
Solution Approach 2:
The patent optimizes the thickness parameters of individual magnetic layers and nonmagnetic layers to achieve desired shielding performance. By carefully controlling the thickness of each layer (e.g., magnetic layer thickness of 1-10 nm, nonmagnetic layer thickness of 5-20 nm), the multilayer structure achieves enhanced electromagnetic wave attenuation while remaining compatible with standard thin-film deposition techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electromagnetic interference, leading to more stable operations and improved performance by effectively attenuating electromagnetic waves across various directions.
Implementation Method 1
a shield layer including a magnetic layer and a nonmagnetic layer, the nonmagnetic layer being between the semiconductor element and the magnetic layer
Data Source
AI summary
According to one embodiment, an electronic device includes first to third members, first and second elements. The second member is between the first and third members. The first element is between the first and second members. The second element is between the second and third members. The first member includes first nonmagnetic layers and a first magnetic layer. The first magnetic layer is provided between one of the first nonmagnetic layers and an other one of the first nonmagnetic layers. The second member includes second nonmagnetic layers and a second magnetic layer. The second magnetic layer is provided between one of the second nonmagnetic layers and an other one of the second nonmagnetic layers. The third member includes third nonmagnetic layers and a third magnetic layer. The third magnetic layer is provided between one of the third nonmagnetic layers and an other one of the third nonmagnetic layers.