Magnetic Insulation Shielding Ring for Spark Prevention
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Solution Overview
Problem
In semiconductor device manufacturing, existing reaction chambers face issues with sparking and pollution due to metal particle deposition on insulating rings, leading to reduced processing stability and potential damage to work pieces during the magnetron sputtering process.
Innovation Solution
A reaction chamber design featuring a Faraday shielding ring and a shielding ring made of magnetic insulation material, with a slot passing through the ring surface in an axial direction, is implemented. The shielding ring is stacked vertically on the insulating ring, covering its inner peripheral wall and preventing metal particles from depositing on the insulating ring, thus reducing the risk of sparking and pollution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a Faraday shielding ring is provided with a slot to prevent metal film deposition on inner side walls, then energy coupling is improved, but metal particles may deposit on the insulating ring and cause sparking
Solution Approach 1:
A shielding ring made of magnetic insulation material is introduced as an intermediary component between the Faraday shielding ring and the insulating ring. This shielding ring acts as a mediator that intercepts metal particles before they reach the insulating ring, preventing sparking while maintaining the slot configuration for energy coupling.
Solution Approach 2:
The shielding structure is segmented into multiple components: the Faraday shielding ring with slots for energy coupling, the intermediate shielding ring for particle interception, and the insulating ring for electrical isolation. This segmentation allows each component to perform its specific function without interfering with others.
2Reliability
If the Faraday shielding ring is made unclosed with a slot, then conductive path prevention is achieved, but metal particles can reach and deposit on the insulating ring
Solution Approach 1:
The shielding ring serves as an intermediary that blocks metal particles from reaching the insulating ring. It is positioned between the Faraday shielding ring and the insulating ring, capturing particles that pass through or around the slot configuration.
Solution Approach 2:
The solution addresses the particle deposition problem not by closing the slot (which would affect energy coupling), but by adding a component in a different spatial dimension - the shielding ring extends radially inward to intercept particles in the path between the Faraday ring and insulating ring.
3Reliability
If metal particles deposit on the insulating ring, then processing stability deteriorates, but increasing ring thickness reduces available space
Solution Approach 1:
The shielding ring acts as a sacrificial intermediary that collects metal particles instead of allowing them to deposit on the insulating ring. This protects the insulating ring and maintains processing stability without requiring increased thickness of critical components.
Solution Approach 2:
The shielding ring functions as a disposable or easily replaceable component that accumulates metal particle deposition. By making this component sacrificial, the more critical insulating ring is protected from contamination, maintaining processing stability without needing excessive thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the risk of sparking and improves processing stability by directing metal particles to deposit on the shielding ring, minimizing contamination and damage to work pieces, while also increasing the available space within the reaction chamber.
Implementation Method 1
an induction coil 11 surrounding outer sides of side walls thereof, which is electrically connected with a radio frequency (RF) power supply 12 via a matcher 13 and configured to generate an alternating magnetic field in the reaction chamber 10, such that a processing gas in the reaction chamber 10 is excited by energy of the alternating magnetic field to form plasma
Implementation Method 2
The basic principle of the magnetron sputtering is as follows: a reaction gas is excited to form plasma, which is used for bombarding a target material disposed in a reaction chamber, such that particles escape from a surface of the target material and then are deposited on a work piece
Implementation Method 3
the Faraday shielding ring 14 is made of a magnetic insulation material and provided with a slot (not shown in the figures) thereon at the ring surface thereof, which passes through the ring surface thereof in an axial direction, so that the Faraday shielding ring 14 is unclosed in its circumferential direction
Data Source
AI summary
A reaction chamber and a semiconductor processing device, comprise a Faraday shielding ring (21) made of a magnetic insulation material and an insulating ring (22) made of an insulating material; the Faraday shielding ring (21) is provided with a slot thereon passing through a ring surface thereof in an axial direction; both the Faraday shielding ring (21) and the insulating ring (22) are disposed in the reaction chamber surrounding an inner peripheral wall of the reaction chamber, and the Faraday shielding ring (21) is stacked on the insulating ring (22) in a vertical direction. A shielding ring (211) is disposed surrounding an inner peripheral wall of the insulating ring (22), the shielding ring (211) is connected to an area of a lower surface of the Faraday shielding ring (21) adjacent to a center of the reaction chamber, and the shielding ring (211) is made of a magnetic insulation material and provided with a slot thereon passing through a ring surface thereof in an axis direction. The reaction chamber and the semiconductor processing device can not only avoid or reduce the risk of sparking, but also reduce the pollution of the reaction chamber caused by the flaking off of metal particles; and in addition, it is possible to increase an inner diameter and an available space of the reaction chamber.