Magnetic-Field Melting Solder for Fast Electrode Joining
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Solution Overview
Problem
Existing solder technologies do not effectively utilize magnetic fields to melt solder efficiently, and the timing and purpose of magnetic field application in current methods differ, limiting the mechanical properties and heating efficiency of solder joints.
Innovation Solution
A magnetic-field melting solder comprising solder material and magnetic material, with a proportion of magnetic material between 0.005% to 20% by weight, that melts using an AC magnetic field, allowing for rapid heating and joining of electrodes in electronic components while minimizing impact on the joining function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If magnetic particles are added to solder material to enable magnetic field heating, then heating efficiency and temperature rise rate are improved, but the joining function of the solder may be adversely affected
Solution Approach 1:
The patent applies parameter changes by precisely controlling the proportion of magnetic material in the solder to fall within 0.005% to 20% by weight. This quantitative parameter optimization enables the solder to absorb sufficient magnetic field energy for rapid heating while maintaining adequate joining functionality, thus resolving the contradiction between heating efficiency and reliability.
Solution Approach 2:
The patent creates a composite solder material by combining solder material with magnetic material in specific proportions. This composite structure allows the solder to simultaneously exhibit both magnetic field absorption characteristics (for rapid heating) and soldering characteristics (for reliable joining), effectively resolving the contradiction between the two opposing requirements.
2Productivity
If magnetic material proportion is increased to enhance heating efficiency, then temperature rise rate is improved, but solder joining function deteriorates
Solution Approach 1:
The patent resolves this contradiction by establishing an optimal parameter range for magnetic material content (0.005% to 20% by weight). Within this range, the solder achieves sufficient magnetic field absorption for rapid heating while preserving adequate joining function, thus optimizing both productivity and reliability simultaneously.
3Shape
If solder material is melted before magnetic field application for particle alignment, then magnetic particles can be arranged properly, but heating time is increased
Solution Approach 1:
The patent inverts the conventional sequence by applying the magnetic field during the melting process rather than after complete melting. This allows magnetic particles to align progressively as the solder melts, achieving proper particle arrangement while significantly reducing total heating time compared to the traditional two-stage process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic-field melting solder achieves rapid temperature rise and efficient melting of solder material, reducing joining time while maintaining the original solder function, enabling quick electrical connections with minimal impact on substrates and electronic components.
Implementation Method 1
solder material and magnetic particles generate heat by the action of an AC magnetic field
Implementation Method 2
magnetic particles, which generate heat quickly by the action of the AC magnetic field
Implementation Method 3
a magnetic field is applied around the molten matrix. Upon application of the magnetic field, unmolten magnetic particles are aligned along a direction of the magnetic field
Data Source
AI summary
A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.