Magnetic Spin Chuck Holding Pins for Bevel Cleaning
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in uniformly cleaning the outer edges of substrates due to the design of spin chucks, which can lead to contamination and processing defects.
Innovation Solution
A substrate holding and rotating device with a rotating member, holding members that can switch between abutting and spacing from the substrate's edge, and a magnetic force-based switching mechanism to facilitate uniform cleaning of the outer edge by alternating the holding state of the holding members during rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the outer edge of the substrate is held by the plurality of holding pins, then the substrate is securely held for rotation, but the whole of the outer edge of the substrate is difficult to uniformly clean
Solution Approach 1:
The holding members are divided into two functional groups: a first plurality of holding members that remain in contact with the substrate outer edge for stable holding, and a second plurality of holding members that are separated from the substrate outer edge to enable cleaning. This segmentation allows simultaneous achievement of secure holding and uniform cleaning capability
Solution Approach 2:
Different regions of the holding members are assigned different functions: the first holding members maintain substrate contact for stability, while the second holding members are positioned away from the substrate to create cleaning access. This local differentiation resolves the contradiction between holding reliability and cleaning uniformity
2Reliability
If the holding members are continuously in contact with the substrate outer edge, then the substrate is securely held during rotation, but contaminants cannot be removed from the outer edge
Solution Approach 1:
The holding members are configured to periodically alternate between contact and separation states during substrate rotation. The first holding members maintain continuous contact for stability, while the second holding members periodically separate to allow cleaning agents to access and remove contaminants from the outer edge
3Device complexity
If a conventional spin chuck design is used, then the device structure is simple, but the outer edge cleaning effectiveness is insufficient
Solution Approach 1:
The spin chuck incorporates a segmented holding member system with at least two distinct groups: first holding members for substrate engagement and second holding members for cleaning access. This segmentation enables effective outer edge cleaning while maintaining acceptable structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for effective cleaning of the entire outer edge of the substrate, preventing contamination and processing defects by creating a space for cleaning between the substrate and the holding members, ensuring reliable removal of contaminants.
Implementation Method 1
a first magnetic force generating member that switches the holding members positioned in the first region to the substrate held state by a magnetic force, and a second magnetic force generating member that switches the holding member positioned in the second region to the substrate released state by a magnetic force
Data Source
AI summary
When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate.