Magnetic Substrate Holding Structure to Prevent Warpage in Transfer
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Solution Overview
Problem
In semiconductor fabrication processes, substrate transfer devices often experience substrate abrasion or warpage due to repetitive handling, leading to reduced transfer accuracy and facility output.
Innovation Solution
A substrate transfer device with a housing and substrate hold structure featuring lower and upper supports that securely fix the substrate using magnetic hold members, preventing detachment and deformation during transfer and storage, and allowing for increased storage capacity by minimizing support surface contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is repeatedly transferred using conventional transfer devices, then the transfer operation can be performed, but substrate abrasion and warpage occur leading to reduced transfer accuracy
Solution Approach 1:
The substrate support structure is divided into multiple independent support points (first support portion and second support portion) that can independently adjust their positions. This segmentation allows each support point to be optimized for specific functions - one for initial placement and another for final positioning, thereby preventing substrate warpage and abrasion while maintaining transfer accuracy over repeated operations.
Solution Approach 2:
The substrate transfer device employs movable support portions that can dynamically adjust their positions along the substrate surface. The first support portion can move to accommodate substrate placement, and the second support portion can independently position itself for precise transfer operations. This dynamic adjustment capability prevents substrate warpage by adapting to substrate variations, thereby maintaining transfer accuracy without compromising productivity.
2Stability of the object's composition
If more support structures are added to prevent substrate warpage, then substrate stability improves, but device complexity increases
Solution Approach 1:
Each movable support portion is designed to perform multiple functions: supporting the substrate during storage, positioning the substrate during transfer, and adjusting to substrate variations. The first support portion handles initial substrate placement and stabilization, while the second support portion manages precise positioning. This multi-functionality achieves high substrate stability without requiring additional complex support structures.
Solution Approach 2:
The movable support portions automatically adjust their positions based on substrate characteristics and transfer requirements. The support structure serves itself by detecting substrate placement and independently positioning the support points to provide optimal support, eliminating the need for complex external control mechanisms while maintaining high substrate stability.
3Stability of the object's composition
If the support surface contact area is increased to prevent substrate warpage, then substrate stability improves, but storage capacity decreases
Solution Approach 1:
The support contact area is segmented into discrete support points rather than a continuous large contact surface. The first support portion and second support portion provide localized support at specific points on the substrate. This segmentation maintains substrate stability by preventing warpage at critical points while minimizing overall contact area, thereby allowing increased storage capacity in the housing.
4Manufacturing precision
If a rigid fixed support structure is used to secure the substrate, then transfer accuracy is maintained, but substrate abrasion increases
Solution Approach 1:
The support portions are designed to be movable rather than rigidly fixed, allowing them to gently contact and position the substrate without applying excessive force. The dynamic support points can adapt their contact pressure and position, maintaining transfer accuracy while minimizing mechanical stress and abrasion on the substrate surface during repeated transfer operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides improved storage stability and increased storage capacity by rigidly fixing substrates and preventing warpage, while maintaining a simplified and compact structure.
Implementation Method 1
a substrate hold structure that fixes the substrate in the housing. The substrate hold structure may include: a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, the lower support including a first hold member beneath the substrate; and an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing, the upper support including a second hold member
Data Source
AI summary
Disclosed is a semiconductor transfer device comprising a housing having a surface that has an opening through which a substrate is introduced, and a substrate hold structure that fixes the substrate in the housing. The substrate hold structure includes a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, and an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing and includes a second hold member. An operation of the upper support causes the second hold member to move onto the substrate such that the second hold member contacts a top surface of the substrate and overlaps the first hold member. An extension part penetrates the housing and protrudes onto an outer surface of the housing.