Substrate Inductors With Magnetic Layer for Compact Package Design
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Solution Overview
Problem
There is an ongoing need for smaller packages with improved inductor performance, as existing packages struggle to achieve efficient and compact inductor designs.
Innovation Solution
The package comprises an integrated device and a substrate with a magnetic layer, dielectric layers, and interconnects configured as inductively coupled inductors, enhancing inductive properties such as inductance and Q factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inductor designs are used, then inductor performance is achieved, but package size increases
Solution Approach 1:
The patent applies composite materials by integrating a magnetic layer with specific permeability (μr ≥ 10) combined with conductive interconnect traces on a substrate. This composite structure enhances the inductive properties of the inductor, achieving higher inductance and Q-factor in a compact area. The magnetic layer composite with the conductive trace forms an efficient inductor that reduces the required package size while maintaining or improving performance.
Solution Approach 2:
The patent utilizes parameter changes by modifying the magnetic layer's permeability (μr ≥ 10) and adjusting the geometric parameters of the interconnect traces (width, length, pattern). By optimizing these parameters, the inductor achieves improved performance metrics (inductance value, Q-factor) within a smaller footprint, directly addressing the contradiction between performance and size.
2Area of stationary object
If inductor size is reduced, then package compactness is improved, but inductor performance deteriorates
Solution Approach 1:
The magnetic layer composite material with enhanced permeability compensates for the reduced physical size of the inductor. By using this composite structure, the patent achieves high inductance values and Q-factors in a compact inductor design, preventing performance deterioration despite size reduction.
Solution Approach 2:
The patent transitions from planar inductor designs to a multi-layer three-dimensional structure by stacking the magnetic layer over the conductive interconnect traces on the substrate. This dimensional change increases the effective inductance path without increasing the planar footprint, enabling compact inductor size while maintaining performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the creation of smaller inductors with performance comparable to or exceeding larger inductors, enabling more compact and efficient device designs.
Implementation Method 1
The substrate comprises at least one magnetic layer... enhancing inductive properties such as inductance and Q factor
Implementation Method 2
The second inductor and the first inductor are configured to operate as inductively coupled inductors
Data Source
AI summary
A package comprising an integrated device and a substrate coupled to the integrated device through a plurality of solder interconnects. The substrate comprises at least one magnetic layer, at least one dielectric layer; and a plurality of interconnects. The plurality of interconnects comprise a first set of interconnects that are configured to operate as a first inductor and a second set of interconnects that are configured to operate as a second inductor. The second inductor and the first inductor are configured to operate as inductively coupled inductors.