Magnetically Aligned Thermal Interface Layer for Heat Conduction
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Solution Overview
Problem
Existing thermal interface materials lack efficient methods to align and orient particles for enhanced thermal conductivity and electrical conductivity, leading to suboptimal performance in heat transfer applications.
Innovation Solution
A thermal interface layer comprising magnetically responsive and thermally conductive particles, aligned and oriented using magnetic fields, with a polymeric binder, to enhance thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If particles are randomly oriented and distributed in thermal interface materials, then the manufacturing process is simple, but the thermal conductivity and electrical conductivity are suboptimal
Solution Approach 1:
The patent replaces mechanical alignment methods with magnetic field application to orient particles. Magnetic fields act on the particles during curing to achieve alignment without complex mechanical positioning systems, thereby improving thermal and electrical conductivity while avoiding mechanical complexity
Solution Approach 2:
The patent changes the physical state or arrangement parameter of particles from random distribution to magnetically aligned orientation. By applying magnetic fields during the curing process, particles are repositioned to optimize conductivity pathways, transforming the material's internal structure to enhance performance
2Reliability
If high volume loading of particles is used to improve thermal conductivity, then thermal performance increases, but the material becomes more difficult to process and apply
Solution Approach 1:
The patent applies magnetic fields during the curing process to pre-align particles before the material fully sets. This preliminary alignment action occurs while the material is still pliable, allowing high particle loading to be managed effectively without compromising processability or requiring excessive force
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alignment and orientation of particles significantly improve thermal conductivity by at least 10% and electrical conductivity, enabling more efficient heat transfer and electrical conduction.
Implementation Method 1
Magnetic fields can be used to alter a distribution of magnetic particles in a resin
Implementation Method 2
The first and second particles have respective real parts of relative magnetic permeability μ′1 and μ′2 such that for at least one frequency less than about 1 GHz, μ1/μ′2≥5
Implementation Method 3
The second particles have a thermal conductivity of at least 10 W/mK
Implementation Method 4
A thermal interface material can be used to provide improved thermal contact between two objects
Data Source
AI summary
A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1−0.17 V+0.002 V2.