Magnetic Thermal Interface Material for Semiconductor Packages
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Solution Overview
Problem
Current thermal interface materials used in semiconductor packages are prone to movement and thermal resistance issues due to their soft nature, especially under external forces during fabrication, leading to increased thermal resistance values.
Innovation Solution
A thermal interface material with magnetic particles aligned in a defined direction, such as perpendicular to the surface, is used to improve thermal conductivity and stability, preventing the material from being displaced and ensuring continuous heat dissipation paths between semiconductor packages and heat spreaders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If soft thermal interface material is used, then thermal conductivity is improved, but the material becomes prone to movement and displacement under external forces
Solution Approach 1:
The patent uses a composite material consisting of magnetic particles suspended in a polymer compound. The magnetic particles provide thermal conductivity while the polymer matrix provides structural stability. This composite structure resolves the contradiction by combining materials with complementary properties - the magnetic particles enhance heat dissipation while the polymer prevents displacement under external forces.
Solution Approach 2:
The patent changes the physical and chemical parameters of the thermal interface material by incorporating magnetic particles with specific properties (magnetic susceptibility, particle size, concentration). By adjusting these parameters, the material achieves both improved thermal conductivity and enhanced stability resistance to displacement, resolving the contradiction between thermal performance and structural integrity.
2Temperature
If thermal interface material is used to improve heat dissipation, then thermal resistance is reduced, but the material may be pumped out of the package leading to higher thermal resistance
Solution Approach 1:
The polymer compound matrix acts as a binding medium that holds the magnetic particles in place while maintaining thermal conductivity. This composite structure prevents the material from being pumped out of the package under external forces, ensuring reliable material retention and consistent thermal performance throughout the device lifecycle.
Solution Approach 2:
The polymer compound serves as an intermediary between the magnetic particles and the package structure. It provides mechanical support and anchoring for the magnetic particles, preventing their displacement and pump-out while maintaining the thermal conduction pathway. This intermediary role resolves the contradiction between achieving low thermal resistance and ensuring material retention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic thermal interface material provides enhanced thermal conductivity and maintains compactness, reducing thermal resistance and ensuring effective heat dissipation, even under external forces, thus improving the thermal performance of semiconductor packages.
Implementation Method 1
magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts
Implementation Method 2
provide desired thermal conductivity between the first and second parts
Data Source
AI summary
Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.