Magnetic Tool for Embedding Chip Modules in Smart Cards
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Solution Overview
Problem
Current methods for embedding chip modules into data carriers, such as smart cards, often result in surface damage due to pitting caused by contact with dies, leading to conductivity issues and uneven surfaces, which complicates handling and printing.
Innovation Solution
A tool with a central suction cup and raised semi-circular areas around its perimeter is used to gently insert chip modules into data carriers, employing heat treatment and gas cleaning to secure the module without direct contact, thereby preventing pitting and ensuring a smooth surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a die is used to punch and transfer the chip module, then the module can be moved into the recess, but the metal surface of the module is damaged causing pitting
Solution Approach 1:
The patent replaces the mechanical contact system (die punching and pressing) with a magnetic field-based system. Magnets embedded in the tool face attract and hold the chip module without physical contact during transfer, eliminating mechanical pressure that causes pitting while maintaining secure handling and positioning capabilities.
2Strength
If the chip module surface is pressed to ensure good contact, then bonding is improved, but the surface becomes uneven due to pitting
Solution Approach 1:
The patent eliminates mechanical pressing that causes surface deformation by using magnetic attraction forces. The magnets hold the module securely against the recess surface through magnetic field attraction, achieving strong bonding without applying mechanical pressure that would create pitting or unevenness on the module surface.
3Productivity
If the chip module is handled with traditional tools, then it can be transferred efficiently, but the metal contacts on the surface are vulnerable to damage
Solution Approach 1:
The patent substitutes mechanical handling tools with a magnetic field-based handling system. Magnets embedded in the tool face create magnetic attraction that securely holds the chip module during transfer operations, enabling efficient automated handling while completely avoiding mechanical contact that could damage the delicate metal contacts on the module surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents surface damage and ensures secure, even insertion of chip modules into data carriers, maintaining conductivity and enabling accurate printing by distributing pressure evenly and using heat-resistant materials.
Implementation Method 1
a suction cup provided in a central region of said face
Implementation Method 2
the method involves heat treating said module prior to being inserted in the data carrier
Data Source
Figure 1~2
AI summary
A tool having a face (4) with sides, such a side (4a); towards a central region of the face there is a suction area, (5) formed by a suction cup which in this embodiment is shown as a round suction cup. The suction is provided by aperture (6) which leads to a suction device (not shown). The tool has raised areas (7) that are positioned between the corners of the tool face and these allow for pressure is to be evenly distributed across a module face when it is being pressed into a recess on a data carrier while avoiding pitting of the module face due to debris being picked up on the tool face (4).