Magnetic-Transfer Crystal Oscillator With Thinned Quartz Structure
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Solution Overview
Problem
Conventional quartz crystal oscillators with thinned portions require additional manufacturing steps and risk size precision issues due to the need for bonding wires and robotic arm transfer, which complicates the integration with communication electronic products.
Innovation Solution
A crystal oscillator design featuring a thinned portion with side extensions and magnetic layers, allowing for precise electrode formation and magnetic transfer onto a circuit board without robotic arms, using a metal mask with strategically placed openings and magnetic layers for enhanced precision and ease of integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the quartz substrate thickness is reduced to achieve higher oscillation frequency, then the oscillation frequency is improved, but the substrate becomes more fragile and difficult to handle during manufacturing
Solution Approach 1:
The patent applies preliminary action by forming the thinned portion of the quartz substrate before depositing the electrode patterns. This sequence allows the substrate to be thinned while still providing mechanical support during subsequent manufacturing steps, preventing damage to the already-thinned substrate. The thick portions are retained to provide structural integrity during electrode formation and assembly processes.
Solution Approach 2:
The patent implements local quality by creating regions of different thickness within the same substrate - thinned portions for high-frequency oscillation and thick portions for mechanical strength. This localized differentiation allows the substrate to simultaneously achieve high oscillation frequency in critical areas while maintaining overall structural integrity through thicker supporting regions.
2Ease of operation
If bonding wires are used to electrically connect electrodes on opposite surfaces, then electrical connection is achieved, but additional manufacturing steps and complexity are introduced
Solution Approach 1:
The patent merges the electrical connection function into the substrate structure itself by extending electrodes from opposite surfaces to meet at the thinned portion. This eliminates the need for separate bonding wire components and their associated manufacturing steps, while achieving the same electrical connectivity function through integrated design.
Solution Approach 2:
The patent extracts the bonding wire function entirely from the design by creating direct electrical pathways through the substrate geometry. The thinned portion acts as the connection medium itself, removing the need for external bonding wires and simplifying both the device structure and manufacturing process.
3Manufacturing precision
If photolithography and thin film deposition are used to form electrodes on the thinned portion, then precise electrode patterns are achieved, but the thinned portion is easily damaged during these processes
Solution Approach 1:
The patent performs the substrate thinning operation before subsequent photolithography and thin film deposition steps. This preliminary action ensures that the substrate maintains adequate thickness and mechanical strength during these delicate processes, preventing damage while still enabling precise electrode pattern formation on the thinned regions.
Solution Approach 2:
The patent creates local quality differences in substrate thickness, with thinned portions optimized for electrode deposition and thick portions providing mechanical support during processing. This allows precise electrode patterns to be formed on vulnerable thinned areas while robust thick areas withstand the mechanical stresses of manufacturing processes.
4Manufacturing precision
If a metal mask is used for thin film deposition, then electrode formation is achieved, but positional correspondence between mask openings and electrode positions may be inaccurate
Solution Approach 1:
The patent merges the alignment reference function into the substrate structure itself by using the thinned portion geometry as the positioning reference. The metal mask openings are aligned with the pre-formed thinned regions, eliminating the need for separate alignment marks or complex positioning systems, thereby improving positional accuracy while reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the precision of electrode formation and enables direct magnetic transfer of the crystal oscillator to a circuit board, reducing manufacturing complexity and improving the integration process with communication electronic products.
Implementation Method 1
A quartz crystal oscillator is a device that utilizes a piezoelectric effect of a quartz crystal to generate an oscillating frequency
Data Source
AI summary
A crystal oscillator includes an oscillating main body, a top electrode layer, a bottom electrode layer, and a magnetic layer. The oscillating main body includes a thinned portion and a side portion. The thinned portion has an upper surface and a lower surface opposite to each other and respectively defining an upper surface work portion and a lower surface work portion. The side portion is connected to one end of the thinned portion and extends upwardly. The top electrode layer is disposed on the upper surface of the thinned portion, and includes a top work portion disposed on the upper surface work portion. The bottom electrode layer is disposed on the lower surface of the thinned portion, and includes a bottom work portion disposed on the lower surface work portion. The magnetic layer is disposed on the side portion, and is spaced apart from the top electrode layer.