Magnetic Tunnel Junction Antifuse With Non-Magnetic Stack

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Solution Overview

Problem

Current magnetoresistive memory technologies, such as MTJs, require complex magnetic stacks and high voltages for programming, leading to increased cost and complexity, and polysilicon resistors cause damage to surrounding circuit components.

Innovation Solution

Implement a non-magnetic conductive layer structure for fuses and antifuses, using a first and second non-magnetic conductive layer with an insulator in between, which reduces complexity and voltage requirements, and incorporates a reference resistance made of parallel MTJ devices to track manufacturing variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complex magnetic stacks are used in magnetoresistive memory technologies, then programming capability is achieved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improveprogramming capabilityVSAvoidmagnetic stack complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and removes the complex magnetic stack components from the fuse/antifuse structure, retaining only the essential non-magnetic conductive layers and insulator. This eliminates the need for magnetoresistive materials and complex magnetic layer stacking while preserving the core functionality of permanent conduction after programming, thereby reducing device complexity and manufacturing cost.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces expensive and complex magnetic stack materials with simpler, more cost-effective non-magnetic conductive materials. The simplified structure uses readily available conductive layers and insulators that are easier and cheaper to manufacture, reducing both material costs and manufacturing complexity while achieving the same antifuse functionality.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Reliability

If high voltages are used for programming magnetoresistive devices, then programming is achieved, but damage to surrounding circuit components occurs

Engineering Contradiction:
Improveprogramming achievementVSAvoiddamage to surrounding circuits
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the electrical parameters of the programming process by using a simplified non-magnetic conductive layer structure that requires lower voltages for programming compared to complex magnetoresistive devices. This parameter change reduces the harmful high voltage effects on surrounding circuit components while still achieving reliable programming of the fuse/antifuse structure.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If polysilicon resistors are used for fuses, then fuse functionality is achieved, but surrounding circuit components are damaged

Engineering Contradiction:
Improvefuse functionalityVSAvoidcircuit component damage
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces polysilicon resistors with a simplified non-magnetic conductive layer structure that is easier to manufacture and causes less damage to surrounding circuits. The new structure uses non-magnetic conductive materials that can be deposited using standard semiconductor fabrication processes, reducing manufacturing complexity and eliminating the harmful effects associated with polysilicon resistor fabrication.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design minimizes defect risk, manufacturing complexity, and costs while ensuring reliable operation with lower voltage programming, protecting sense amplifiers and allowing efficient current management.

Implementation Method 1

an insulator above the first non-magnetic conductive layer; and a second non-magnetic conductive layer above the insulator

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

The direction of the magnetization vectors of the free magnetic region may be switched and/or programmed (for example, through spin orbit torque (SOT) and/or spin transfer torque (STT)) by application of a write signal

Methodology Applied
Scientific EffectSpin transfer torque:

Implementation Method 3

A magnetoresistive stack used in a memory device (e.g., MRAM) includes at least one non-magnetic layer disposed between a 'fixed' magnetic region and a 'free' magnetic region

Methodology Applied
Scientific EffectMagnetoresistance: Magnetoresistance

Data Source

PatentUS20250292850A1Magnetic tunnel junction Anti-fuse including non-magnetic stack
Publication Date: 2025.09.18 EVERSPIN TECHNOLOGIES INC
  • US20250292850A1 patent drawing
  • US20250292850A1 patent drawing
  • US20250292850A1 patent drawing

AI summary

An antifuse device may comprise an antifuse bit including: a first non-magnetic conductive layer, an insulator above the first non-magnetic conductive layer, and a second non-magnetic conductive layer above the insulator, wherein when the insulator is disrupted, the first non-magnetic conductive layer and the second non-magnetic conductive layer permanently conduct an electrical current from one to another.