Magnetic Via Interconnect for Integrated Circuits
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Solution Overview
Problem
Through-silicon vias (TSVs) in electronic devices face parasitic phenomena such as leakage currents and mechanical brittleness, requiring complex production processes and increasing space, while existing solutions like transceiving antennas and magnetic cores improve coupling but are complex to produce.
Innovation Solution
An integrated electronic device with a transceiving antenna and magnetic via, where the magnetic via is filled with ferromagnetic material and extends through the substrate, providing a communication channel and reducing the need for TSVs by enhancing coupling between integrated circuits and external devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TSVs are used to connect integrated circuits, then electrical connection is achieved, but parasitic phenomena (leakage currents, inductances, capacitances) increase
Solution Approach 1:
The patent replaces the traditional TSV electrical connection mechanism with a magnetic field-based communication mechanism. Transceiving antennas embedded in the integrated circuits communicate via magnetic coupling through a magnetic core, eliminating the need for physical electrical contacts and thereby eliminating parasitic inductances, capacitances, and leakage currents associated with TSVs.
2Area of stationary object
If TSV diameter is reduced to minimize space, then space occupation decreases, but mechanical brittleness increases and testing becomes difficult
Solution Approach 1:
The invention replaces the mechanical TSV structure with an embedded magnetic core and wireless communication system. The magnetic core can be formed as a continuous structure through the substrate using standard semiconductor manufacturing techniques, avoiding the mechanical brittleness of thin-walled TSVs. The transceiving antennas communicate through magnetic coupling, eliminating the need for physical electrical contacts.
3Adaptability or versatility
If multiple TSVs are multiplied to provide required connections in complex systems, then connection capability increases, but space occupied by TSVs increases
Solution Approach 1:
The magnetic core serves multiple functions simultaneously: it provides magnetic coupling for communication between multiple integrated circuits, enables wireless power transfer, and eliminates the need for separate electrical connection structures. The transceiving antennas can communicate with multiple circuits through the same magnetic core, providing universal connectivity without requiring proportional increases in physical connection structures.
4Reliability
If TSV production process is implemented, then electrical connections are created, but production complexity increases due to insulation and through-hole formation
Solution Approach 1:
The patent replaces the complex TSV manufacturing process with a magnetic core formation process that uses standard semiconductor manufacturing techniques. The magnetic core is formed by depositing magnetic material layers and patterning them through photolithography, eliminating the need for chemical etching, through-hole formation, and electrical insulation operations required for TSVs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies production, reduces the number of TSVs needed, and improves communication efficiency between integrated circuits and external devices, while minimizing parasitic effects and mechanical brittleness.
Implementation Method 1
the magnetic via 4 has the shape, for example, of a truncated pyramid or of a truncated cone set upside down; consequently, it has a top base 5, a bottom base 6, and a height h, and is filled with magnetic material, i.e., material that has ferromagnetic characteristics and a relative magnetic permeability μ r that is very high
Implementation Method 2
filled with magnetic material, i.e., material that has ferromagnetic characteristics and a relative magnetic permeability μ r that is very high (in general much greater than 1), for example, greater than 10, at the frequency or frequencies of interest
Implementation Method 3
a portion of the body 2, shown schematically in Figure 1, provides an integrated transceiving circuit 10. The integrated transceiving circuit is electrically connected to the transceiving antenna 3 and enables the integrated electronic device 1 to receive and transmit electromagnetic signals by means of the transceiving antenna 3
Data Source
Figure 1~3
Figure 2
Figure 4a~4b
AI summary
An integrated electronic device (1) having a body (9) of semiconductor material and a first antenna (3;3a) which enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna (3b,3c). The integrated electronic device (1) has a first via (4;4a- 4d;50;50a;53) of magnetic material arranged at least in part inside the body (9), which forms, in use, a communication channel between the first antenna (3;3a) and the further antenna (3b,3c).