Magnetic Wafer Plating Jig for Uniform Metal Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device manufacturing, achieving uniform metal plating across wafers of different sizes during electroplating processes is challenging due to the need for precise sizing of shields between the anode and wafer, which existing technologies fail to address effectively.
Innovation Solution
A wafer plating jig system with an electrically insulating base featuring overlapping cavities of varying depths and magnetic attractors, coupled with a magnetically attractive cover plate, allows for secure and uniform plating of wafers of different sizes by magnetically coupling the cover plate to the base, ensuring consistent force application and sealing, while an RFID tag facilitates identification and customization of plating processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical clamping methods are used to hold wafers during plating, then secure wafer positioning is achieved, but mechanical wear and contamination occur
Solution Approach 1:
The patent replaces mechanical clamping systems with a magnetic field-based holding system. Magnetic attractors embedded in the plating jig create magnetic forces that securely hold wafers during plating without physical contact, eliminating mechanical wear and contamination while maintaining reliable wafer positioning.
Solution Approach 2:
The patent introduces magnetic fields as an intermediary between the plating jig and the wafer. The magnetic attractors generate magnetic fields that act as a non-contact mediator to hold the wafer in place, avoiding direct mechanical contact and its associated wear and contamination problems.
2Adaptability or versatility
If fixed-size plating jigs are used, then simple manufacturing is achieved, but adaptability to different wafer sizes is limited
Solution Approach 1:
The patent designs the plating jig with multiple magnetic attractors of varying strengths and positions that can be selectively activated. This universal design allows a single jig to accommodate wafers of different sizes by adjusting which magnetic attractors are engaged, eliminating the need for multiple fixed-size jigs while managing structural complexity through modular control.
Solution Approach 2:
The patent implements a dynamic magnetic field configuration where the strength and distribution of magnetic forces can be adjusted based on wafer size. By dynamically controlling which magnetic attractors are active and their field intensities, the system adapts to different wafer dimensions without requiring physical reconfiguration of the jig structure.
3Manufacturing precision
If uniform magnetic force distribution is achieved across the wafer, then plating uniformity is improved, but magnetic attractor positioning becomes more complex
Solution Approach 1:
The patent employs magnetic attractors with locally optimized properties, where each attractor is positioned and sized to provide appropriate magnetic force for its specific region of the wafer. This local quality approach ensures uniform overall force distribution while avoiding the need for overly complex global magnetic field configurations, as each local region is independently optimized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables uniform and efficient metal plating across wafers of varying sizes, maintaining consistent force application and reducing mechanical wear, while allowing for simultaneous plating of multiple wafers and customization based on wafer characteristics.
Implementation Method 1
magnetic attractors, at least one positioned within each of the plurality of overlapping cavities... and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base
Data Source
AI summary
A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center surrounded by a support, the cover plate comprising an electrical conductor surrounding the open center and with at least one of the overlapping cavities of the wafer plating jig base.