Magnetic Wafer Transfer Alignment Using Taught Reference Positions
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Solution Overview
Problem
Existing semiconductor wafer transfer systems face challenges in accurately determining and correcting positional misalignments between transfer bodies and substrate reference positions, leading to inefficiencies and potential defects in processing.
Innovation Solution
A substrate transfer method using first and second transfer bodies that float magnetically, allowing for precise alignment and correction of positional misalignments through a controller-driven teaching process, ensuring accurate placement of wafers at reference positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic levitation is used to transfer substrates, then contactless transfer and vacuum maintenance are achieved, but positional alignment precision between transfer bodies and substrate reference positions becomes difficult to control
Solution Approach 1:
The system performs preliminary teaching operations to establish positional relationships between transfer bodies and substrate reference positions before actual substrate transfer. The controller stores reference position information and uses it to pre-calculate transfer trajectories, enabling precise alignment before the substrate is actually moved.
Solution Approach 2:
The system detects actual substrate positions and compares them with reference positions, then feeds back correction information to the controller. The controller adjusts subsequent transfer operations based on this feedback, continuously improving alignment precision while maintaining contactless magnetic levitation transfer.
2Manufacturing precision
If manual teaching operations are performed to establish positional relationships, then alignment accuracy is improved, but operational time and complexity increase
Solution Approach 1:
The system creates a virtual model (copy) of the physical positional relationships between transfer bodies and substrate reference positions. The controller stores reference position information that replicates the spatial configuration, allowing precise alignment control without requiring repeated manual physical adjustments during operation.
Solution Approach 2:
The system replaces manual mechanical teaching operations with automated controller-based positional management. The controller automatically calculates transfer trajectories and adjusts transfer body positions based on stored reference information, eliminating the need for continuous manual intervention while maintaining high alignment accuracy.
3Adaptability or versatility
If multiple transfer bodies are used for substrate transfer, then transfer flexibility and vacuum environment maintenance are improved, but positional relationship detection and correction complexity increases
Solution Approach 1:
The system implements a universal reference position management approach where the controller handles positional relationships for all transfer bodies using the same reference framework. Each transfer body uses the substrate reference positions as a common reference, simplifying the detection and correction process despite having multiple transfer bodies operating flexibly in the vacuum environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency and accuracy of wafer transfer operations by reducing manual intervention and maintaining vacuum environments, thereby improving processing consistency and reducing operational downtime.
Implementation Method 1
each floating from a bottom portion of a substrate transfer area by a magnetic force and moving in a horizontal direction
Data Source
AI summary
A substrate transfer method for transferring a substrate using a first transfer body and at least one second transfer body comprises transferring the substrate using the first transfer body to a predetermined first substrate reference position in a module, receiving the substrate at the first substrate reference position using the second transfer body, and transferring the substrate to a detection device by moving the second transfer body to a predetermined first transfer body reference position and detecting positional misalignment in plan view between a position of the substrate and a predetermined second substrate reference position in the detection device. Each of the first transfer body and the second transfer body floats from a bottom portion of a substrate transfer area by a magnetic force and moves in a horizontal direction while supporting the substrate.