Magnetic Wafer Transfer Across Gate Valve Non-Traveling Regions
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Solution Overview
Problem
Existing substrate processing systems face challenges in efficiently transferring wafers between processing chambers due to non-traveling regions where magnetic floating mechanisms cannot operate, leading to potential loss of floating state and interference with gate valves and lifting pins.
Innovation Solution
The system employs a substrate transfer module with magnetic floating capabilities and a bridging module that assists in navigating non-traveling regions by forming a continuous traveling surface, allowing the module to move between substrate processing chambers via repulsive magnetic forces and specialized coil configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate transfer module uses magnetic floating for transfer, then transfer efficiency is improved, but the module cannot pass through non-traveling regions where magnetic floating is not available
Solution Approach 1:
A bridging module is introduced as an intermediary component that provides a temporary traveling surface in non-traveling regions. The bridging module extends from the chamber wall into the non-traveling region, creating a continuous magnetic floating path that allows the substrate transfer module to pass through areas where magnetic floating would otherwise be unavailable.
Solution Approach 2:
The traveling surface is extended from the chamber floor into the vertical dimension by adding the bridging module. This creates a three-dimensional magnetic floating pathway that allows the substrate transfer module to navigate around non-traveling regions by moving along the extended surface rather than being constrained to the original two-dimensional floor plane.
2Speed
If the substrate transfer module operates continuously in magnetic floating, then transfer speed is improved, but interference with gate valves and lifting pins occurs in non-traveling regions
Solution Approach 1:
The bridging module acts as a mediator that guides the substrate transfer module through non-traveling regions, preventing direct contact and interference with gate valves and lifting pins. By providing a dedicated traveling path, the bridging module isolates the magnetic floating module from potential interference sources in the non-traveling regions.
Solution Approach 2:
The patent replaces mechanical contact-based transfer mechanisms with magnetic floating in the traveling regions, eliminating friction and mechanical wear. The bridging module extends this non-contact magnetic floating capability into non-traveling regions, maintaining the speed advantage while avoiding mechanical interference with gate valves and lifting pins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables seamless wafer transfer through non-traveling regions, maintaining magnetic floating and preventing module interference with gate valves and lifting pins, thus ensuring efficient processing and handling of wafers across multiple chambers.
Implementation Method 1
a floating body-side magnet that acts a repulsive force with the traveling surface-side magnet, the substrate transfer module being configured to be movable on a first traveling surface formed in a region provided with the traveling surface-side magnet by a magnetic floating using the repulsive force
Data Source
AI summary
An apparatus for transferring a substrate to a substrate processing chamber includes: a substrate transfer chamber including a floor surface portion having a traveling surface-side magnet provided therein and a sidewall portion having an opening for transferring the substrate therethrough; a substrate transfer module including a substrate holder and a floating body-side magnet acting a repulsive force with the traveling surface-side magnet, and configured to be movable on a traveling surface formed in a region provided with the traveling surface-side magnet by magnetic floating using the repulsive force; the substrate processing chamber connected to the substrate transfer chamber via a gate valve constituting a non-traveling region in which the substrate transfer module is not movable by the magnetic floating; and a transfer assist mechanism for assisting the transfer of the substrate by the substrate transfer module between the substrate transfer chamber and the substrate processing chamber via the non-traveling region.


