Magnetic Wet Transfer of Microchips for Precise Micro-LED Placement
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Solution Overview
Problem
The existing pick and place method for transferring micro-LEDs in manufacturing micro-LED display devices faces productivity losses as the size of micro-LEDs decreases and display sizes increase, leading to inefficiencies in chip handling and placement.
Innovation Solution
A chip wet-transferring device is developed, utilizing a magnetic field generator to move micro-semiconductor chips parallel to the substrate surface, allowing them to be transferred between the substrate and the chamber's lateral surface, with a liquid supply module ensuring chip mobility and a support member with grooves to align and secure the chips, thereby improving the transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick and place method is used to transfer micro-LEDs, then the transfer process can be performed with simple equipment, but the productivity decreases as the size of micro-LEDs decreases and display sizes increase
Solution Approach 1:
The patent replaces the traditional mechanical pick and place system with a magnetic field-based transfer system. The magnetic field generator applies magnetic force to move micro-LED chips along the transfer substrate without mechanical contact, eliminating the need for complex mechanical grippers and placement mechanisms while significantly improving transfer efficiency and precision.
Solution Approach 2:
The patent introduces a magnetic field as an intermediary between the transfer substrate and the micro-LED chips. The magnetic field acts as a mediator to transfer the chips without direct mechanical contact, enabling precise positioning and high-speed transfer while reducing device complexity.
2Reliability
If direct contact method is used to handle and place chips, then the equipment structure is simple, but friction and damage to chips and substrate increase
Solution Approach 1:
The patent replaces direct mechanical contact with magnetic field interaction. The magnetic field generator creates a contactless force field that manipulates the micro-LED chips, eliminating friction and mechanical stress that would otherwise damage the chips or substrate while maintaining equipment simplicity.
Solution Approach 2:
The patent uses the liquid medium in conjunction with magnetic field to create a fluid-based transfer environment. The liquid supply module provides a liquid layer that reduces friction between the chips and substrate, while the magnetic field provides the driving force, combining fluid dynamics with magnetic manipulation to achieve damage-free transfer.
3Manufacturing precision
If micro-LED size decreases while display size increases, then the display resolution improves, but the pick and place method results in loss of productivity
Solution Approach 1:
The patent replaces the mechanical pick and place system with a magnetic field-based system that can simultaneously manipulate multiple micro-LED chips at high speed. The magnetic field generator can precisely control the position and movement of each chip independently, achieving high placement precision while maintaining high transfer speed even as chip sizes decrease.
Solution Approach 2:
The patent employs dynamic control of the magnetic field to adapt to varying chip sizes and positions. The magnetic field generator can dynamically adjust the field strength and distribution to precisely manipulate smaller chips at higher speeds, enabling the system to maintain productivity regardless of the decreasing chip size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the transfer efficiency of micro-semiconductor chips by minimizing damage and increasing productivity, allowing for precise alignment and removal of chips without direct contact, which reduces friction and damage to the chips and substrate.
Implementation Method 1
a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate
Data Source
AI summary
A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.