Magnetic Element Winding Layout for Uniform Current Distribution
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Solution Overview
Problem
Existing magnetic elements in power electronics suffer from uneven current distribution due to the vertical-winding structure, leading to increased loss and impedance variations in metal windings.
Innovation Solution
A magnetic element with a metal wiring layer that is mechanically divided into multi-turn windings, ensuring equal distances to the magnetic core surface and uniform current distribution through a manufacturing process suitable for large-scale production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a vertical-winding structure with wiring-layer metal winding is used, then the transformer can be manufactured using standard PCB processes, but the current distribution becomes uneven and impedance variations increase
Solution Approach 1:
The patent divides the metal wiring layer into multiple independent winding segments, each forming a separate turn or section of the winding. This segmentation allows each segment to be independently optimized for uniform current distribution while maintaining the overall winding structure, thereby resolving the contradiction between ease of manufacture and current distribution uniformity.
Solution Approach 2:
The patent transitions from a traditional planar wiring-layer structure to a three-dimensional winding structure that wraps around the magnetic column. This dimensional change enables the winding to achieve more uniform current distribution and impedance characteristics while still being compatible with PCB manufacturing processes through innovative integration methods.
2Shape
If the wiring layers are connected through vias perpendicular to the wiring layers, then the vertical winding structure is achieved, but the via length increases and loss increases
Solution Approach 1:
Instead of connecting wiring layers through vertical vias perpendicular to the PCB surface, the patent inverts the connection approach by using horizontal or angled connections within the PCB plane, or by integrating the winding structure directly into the magnetic assembly, thereby eliminating the need for long vertical vias and reducing associated energy losses.
Solution Approach 2:
The patent introduces alternative connection structures such as embedded conductors, plated through-holes with optimized paths, or direct metal-to-metal contacts that serve as intermediaries between wiring layers, replacing the traditional long via structure and reducing energy loss while maintaining the vertical winding configuration.
3Shape
If the metal winding is formed on the wiring layer with H>10W, then the vertical-winding structure is achieved, but the impedance of outer and inner parts becomes uneven
Solution Approach 1:
The patent applies local quality adjustments by varying the width, thickness, or spacing of the metal winding segments at different radial positions. Specifically, the inner portions of the winding are designed with different geometric parameters compared to the outer portions, compensating for the natural impedance variations and achieving uniform current distribution throughout the winding structure.
Solution Approach 2:
The patent systematically changes key geometric parameters of the metal winding, including width, thickness, spacing, and curvature radius, as a function of the radial position from the magnetic column. These parameter changes are carefully optimized to maintain consistent impedance and uniform current distribution across the entire winding, resolving the contradiction between winding geometry and impedance uniformity.
Data Source
AI summary
The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a first groove on the insulation layer; forming a surface copper and a first hole copper respectively on a surface of the insulation layer and an inner surface of the first groove; dividing the surface copper into a first surface copper close to the magnetic core and a second surface copper away from the magnetic core, and dividing the first hole copper into a first sidewall copper close to the magnetic core and a second sidewall copper away from the magnetic core; drilling a hole on the second insulation layer, and forming a first conductor and a third surface copper respectively in the hole and on the second insulation layer.