Magnetic Wire Alignment Apparatus for Stress-Free Sensor Manufacturing
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Solution Overview
Problem
Current methods fail to efficiently align superfine magnetic wires on substrates for mass production of magnetic sensors without inducing additional stresses, which degrades the magnetic properties and hinders productivity.
Innovation Solution
An apparatus comprising a wire supply device, wire alignment device, misplacement detection device, and control device is used to align magnetic wires with controlled tensile force, precise positioning, and magnetic adhesion to prevent stress induction, enabling accurate and stress-free alignment on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect magnetic wire to electrode, then electrical connection is achieved, but additional stresses are induced in the magnetic wire degrading its magnetic properties
Solution Approach 1:
The patent replaces the mechanical soldering process with a magnetic field-based alignment and bonding system. A magnetic head generates a magnetic field that aligns the magnetic wire with grooves on the substrate and bonds it in place, eliminating the need for soldering and the associated mechanical stresses.
Solution Approach 2:
The patent changes the bonding mechanism from thermal-mechanical (soldering) to magnetic field-based. By utilizing the magnetic properties of the wire and applying a controlled magnetic field, the wire is aligned and bonded without the heat and mechanical force that cause stress and degradation.
2Manufacturing precision
If manual placement of magnetic wire on substrate is performed, then positioning is achieved, but additional stresses are induced and productivity is low
Solution Approach 1:
The patent replaces manual mechanical placement with an automated magnetic field-based system. The magnetic head automatically aligns and bonds multiple wires to the substrate simultaneously, achieving both high precision and high productivity through automation.
Solution Approach 2:
The substrate is pre-formed with grooves that guide and position the magnetic wires. This preliminary structural preparation enables automated, high-precision placement without manual intervention, as the grooves naturally guide the wires to their correct positions during the magnetic bonding process.
3Object-affected harmful factors
If ultrasonic bonding is used for each magnetic sensing element, then stress-free bonding is achieved, but productivity is insufficient for mass production
Solution Approach 1:
The patent merges multiple individual bonding operations into a single automated magnetic field-based process. The magnetic head can align and bond multiple wires to multiple sensing elements simultaneously or in rapid sequence, combining the stress-free bonding advantage with mass production capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the mass production of high-performance magnetic sensors with aligned magnetic wires, maintaining optimal magnetic properties and improving productivity by preventing additional stress induction during the alignment process.
Implementation Method 1
a magnetic power generation device that generate magnetic power to have the magnetic wire adhere to the base line on the wire alignment substrate
Data Source
AI summary
Apparatus for aligning magnetic wire aligns magnetic wires on a wire alignment substrate along its base lines, which are positions the magnetic wires are aligned with, with a small interval and without inducing torsional stresses. A microscope is used to detect misplacement between the base line and a reference line that is the magnetic wire taking a form of a straight line under application of tensile force and pulled out by a wire chuck. The misplacement is corrected using a position adjustment device of a substrate attaching base to which the wire alignment substrate is attached. The magnetic wires are temporarily fixed to the wire alignment substrate by magnetic power, and then permanently fixed to the wire alignment substrate using resin while free from the torsional stresses.