Magnetically Coupled Monolithic Coils with Insulator Frame
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Solution Overview
Problem
Existing monolithic integrated inductors face limitations in achieving high dielectric insulation and magnetic coupling efficiency, particularly in semiconductor devices, which affects their performance in applications like galvanic decoupling and power conversion.
Innovation Solution
The integration of magnetically coupled coils with a monolithic insulator frame in a semiconductor body, where one coil is surrounded laterally by the insulator frame while the other is not, enhances dielectric insulation and maintains magnetic coupling, allowing for higher critical electrical field strength and efficient signal decoupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a monolithic insulator frame surrounds one coil laterally to improve dielectric insulation, then the critical electrical field strength increases, but the magnetic coupling efficiency between coils deteriorates
Solution Approach 1:
The insulator frame is positioned only laterally around the first coil rather than completely surrounding it, providing dielectric insulation where needed while leaving magnetic flux paths open for coupling between the two coils. This localized insulation approach resolves the contradiction by applying insulation selectively rather than uniformly.
Solution Approach 2:
The insulator frame is segmented to surround only specific portions of the first coil laterally, rather than forming a complete enclosure. This segmentation allows the frame to provide necessary dielectric insulation while maintaining magnetic coupling efficiency by leaving gaps for magnetic flux penetration.
2Reliability
If the insulator frame completely surrounds one coil to maximize dielectric insulation, then electrical isolation improves, but the device complexity increases
Solution Approach 1:
The insulator frame is implemented as a lateral surround rather than a complete three-dimensional enclosure, segmenting the insulation structure to provide necessary electrical isolation while reducing structural complexity and material usage.
Solution Approach 2:
The insulator frame is extracted from completely surrounding the coil and instead provides lateral insulation only, removing unnecessary portions of the insulator structure that would increase complexity without adding functional value.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves dielectric insulation and magnetic coupling efficiency, enabling higher critical electrical field strength and effective signal decoupling, addressing the limitations of conventional approaches.
Implementation Method 1
The first and second coils are magnetically coupled with each other
Implementation Method 2
An insulator frame in the semiconductor body surrounds the first portion in lateral directions parallel to a main surface of the semiconductor body
Data Source
AI summary
A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding wrapping around the second core structure. The first and second coils are magnetically coupled with each other. An insulator frame in the semiconductor body surrounds the first portion and excludes the second portion. High dielectric strength between the first and the second coils is achieved without patterning a backside metallization for connecting the turns of the windings and without being restricted to thin substrates.