Magnetically-Coupled Inductors on Integrated Passive Devices
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Solution Overview
Problem
Integrated passive devices (IPDs) and processor chips face challenges in achieving optimal performance and cost-effectiveness due to the complexity and cost of including passive components like thin-film magnetic inductors on CMOS dies, which increases manufacturing complexity and cost, and requires these components to be located far from the processor for circuit functionality.
Innovation Solution
The integration of a processor chip with a multilevel wiring structure and a thin-film magnetic inductor, along with an integrated passive device (IPD) having magnetically coupled inductors, where the IPD is positioned close to the processor chip, utilizing a magnetic polymer layer to enhance inductance and reduce electromagnetic interference, and employing an interposer with solder bumps to facilitate electrical communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thin-film magnetic inductors are included on the CMOS die, then the circuit function is achieved, but the manufacturing complexity and cost substantially increase
Solution Approach 1:
The system is divided into two separate components: a processor chip and an integrated passive device (IPD). The passive components (inductors, capacitors, resistors) are fabricated on a separate IPD substrate using suitable processes, while the processor chip uses leading-edge CMOS fabrication. This segmentation allows each component to be optimized independently, resolving the manufacturing complexity issue while maintaining circuit functionality.
Solution Approach 2:
An interposer is introduced as an intermediary component that magnetically couples the inductors on the processor chip with the inductors on the IPD. This interposer enables the two separately fabricated components to work together as a unified circuit, achieving the desired circuit function without requiring direct integration of passive components on the CMOS die.
2Adaptability or versatility
If thin-film magnetic inductors are included on the CMOS die, then the circuit function is achieved, but the cost substantially increases
Solution Approach 1:
By segmenting the system into processor chip and IPD, the expensive leading-edge CMOS process is used only for the processor, while the IPD can be manufactured using less expensive processes suitable for passive components. This reduces the overall manufacturing cost while maintaining circuit functionality.
Solution Approach 2:
The IPD serves as a cost-effective substitute for integrating expensive passive components on the CMOS die. The IPD can be manufactured using standard, less expensive processes, providing the necessary circuit functions at a lower cost point.
3Adaptability or versatility
If passive devices are located far from the processor for circuit functionality, then the circuit operation is enabled, but the performance is reduced
Solution Approach 1:
The interposer with magnetically coupled inductors serves as a mediator that enables strong electromagnetic coupling between the processor chip and IPD even when they are physically separated. This magnetic coupling mechanism allows the passive devices to be located on a separate IPD while maintaining strong interaction, thus preserving circuit performance.
4Reliability
If the IPD is positioned close to the processor chip, then the performance is improved, but the manufacturing complexity increases
Solution Approach 1:
The system is segmented into independently manufacturable components (processor chip, IPD, interposer) that can be fabricated separately using appropriate processes for each component type. This segmentation allows close physical positioning for performance optimization without requiring complex co-fabrication processes.
Solution Approach 2:
The interposer acts as a mediator that simplifies the integration of closely positioned components. It provides the magnetic coupling interface between the processor chip and IPD, enabling close positioning for performance while keeping the manufacturing process manageable through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the inductance and conversion efficiency of the inductors, reduces electromagnetic interference, and allows for a more compact and cost-effective integration of passive components, enhancing the performance of both the IPD and processor chip while minimizing manufacturing complexity.
Implementation Method 1
the first and second inductors are magnetically coupled
Implementation Method 2
utilizing a magnetic polymer layer to enhance inductance
Implementation Method 3
a first conductive winding comprising at least a portion of said first multilevel wiring network, said first conductive winding turning around in a generally spiral manner around said first planar magnetic core
Data Source
AI summary
An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.