Magnetically Permeable Layer Package with Release Layer
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Solution Overview
Problem
The integration of passive components within a semiconductor device package poses challenges due to increased device size and signal transmission path issues, which are exacerbated by burrs formed during the cutting operation of magnetically permeable layers, leading to potential short-circuits and uneven dielectric layers.
Innovation Solution
A semiconductor device package is designed with a magnetically permeable layer, conductive elements, and a dielectric layer that covers the magnetically permeable layer and its openings, forming a double-via structure to separate conductive vias from the permeable layer, reducing burr formation and enhancing adhesion and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetically permeable layer is used in the semiconductor device package, then magnetic shielding and signal integrity are improved, but burrs are formed during cutting operations causing short-circuits and uneven dielectric layers
Solution Approach 1:
A release layer is introduced as an intermediary between the magnetically permeable layer and the dielectric layer. This release layer prevents direct contact between burrs on the magnetically permeable layer and the dielectric layer, thereby preventing short-circuits while maintaining the magnetic shielding function. The release layer acts as a mediator that isolates the harmful burrs from affecting the electrical performance.
Solution Approach 2:
The harmful burrs are effectively removed or isolated from the functional structure by introducing the release layer. The burrs remain on the magnetically permeable layer but are extracted from the electrical conduction path, preventing them from causing short-circuits while preserving the magnetic shielding properties.
2Reliability
If conductive vias are directly connected to the magnetically permeable layer, then electrical connection is achieved, but adhesion is poor and short-circuits occur due to burrs
Solution Approach 1:
The release layer serves as an intermediary between the conductive vias and the magnetically permeable layer. It provides a stable adhesion interface for the conductive vias while preventing direct contact with burrs on the magnetically permeable layer, thereby eliminating short-circuit risks while maintaining good adhesion.
Solution Approach 2:
The connection structure is segmented into multiple layers: the magnetically permeable layer, the release layer, and the dielectric layer with conductive vias. This segmentation separates the magnetic shielding function from the electrical connection function, allowing each layer to optimize its specific role without interference from burrs.
3Volume of moving object
If passive components are embedded within the substrate, then device size is reduced and signal transmission path is shortened, but manufacturing complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated structure: the magnetically permeable layer provides both magnetic shielding and serves as a substrate for embedding passive components. The release layer simultaneously protects against burrs and facilitates the embedding process, reducing overall manufacturing complexity despite the advanced functionality.
Data Source
AI summary
A semiconductor device package includes a magnetically permeable layer having a top surface and a bottom surface opposite to the top surface. The semiconductor device package further includes a first conductive element in the magnetically permeable layer. The semiconductor device package further includes a first conductive via extending from the top surface of the magnetically permeable layer into the magnetically permeable layer to be electrically connected to the first conductive element. The first conductive via is separated from the magnetically permeable layer. A method of manufacturing a semiconductor device package is also disclosed.