Magnetized Substrate Carrier with Embedded Magnets for Magnetic Domain Alignment
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Solution Overview
Problem
In the fabrication of modern electronic devices, the increasing device density and decreasing device dimensions require more stringent requirements for packaging and interconnecting techniques, particularly in wafer level packaging, where creating inductors with aligned magnetic domains is challenging without costly post-deposition processes.
Innovation Solution
A magnetized substrate carrier apparatus is used, featuring a carrier plate and shadow mask with embedded magnets to create a magnetic field that aligns magnetic domains during the deposition of magnetic materials, eliminating the need for costly post-deposition etching and annealing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional deposition methods are used without magnetic field alignment, then the deposition process is simpler and faster, but magnetic domains cannot be properly aligned requiring costly post-deposition processes
Solution Approach 1:
The patent applies preliminary action by incorporating magnets into the substrate carrier apparatus before deposition begins. These magnets create a magnetic field that pre-aligns magnetic domains during the deposition process itself, eliminating the need for subsequent post-deposition annealing or etching processes that would otherwise be required to achieve proper magnetic domain alignment.
Solution Approach 2:
The patent merges the substrate carrier function with magnetic field generation by integrating magnets directly into the carrier apparatus. This combination allows the carrier to simultaneously support the substrate and provide magnetic field alignment, consolidating multiple functions into a single integrated system and eliminating separate post-processing equipment.
2Manufacturing precision
If post-deposition etching and annealing processes are used to align magnetic domains, then magnetic domain alignment is achieved, but production cost and processing time increase
Solution Approach 1:
By performing magnetic domain alignment during the deposition process itself through integrated magnets in the carrier apparatus, the patent eliminates the need for subsequent post-deposition annealing and etching steps. This preliminary action during deposition significantly reduces total processing time and improves production efficiency.
Solution Approach 2:
The patent extracts and eliminates the separate post-deposition processing steps (annealing and etching) by incorporating magnetic field generation directly into the deposition process. This removal of unnecessary intermediate steps streamlines the manufacturing flow and increases productivity.
3Manufacturing precision
If post-deposition processes are employed for inductor fabrication, then magnetic domain alignment is achieved, but energy consumption increases
Solution Approach 1:
The patent performs magnetic domain alignment during deposition through integrated magnets rather than requiring high-energy post-deposition annealing processes. This approach uses lower energy throughout the deposition process itself, reducing overall energy consumption while achieving the same magnetic domain alignment quality.
Solution Approach 2:
The patent converts what would traditionally be a harmful or wasteful requirement (separate high-energy post-processing steps) into a beneficial integrated feature by incorporating magnets into the carrier apparatus. This allows the deposition process itself to provide the alignment function, turning a potential disadvantage into an advantage.
4Productivity
If conventional wafer level packaging techniques are used, then device density can be increased, but inductor fabrication becomes more challenging without costly post-processing
Solution Approach 1:
By implementing magnetic field alignment during deposition through the integrated carrier apparatus, the patent makes inductor fabrication easier and more straightforward. This preliminary action during deposition eliminates complex post-processing requirements, making the overall manufacturing process more accessible and easier to implement in high-density wafer level packaging applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient alignment of magnetic domains during deposition, reducing energy consumption and eliminating costly post-processing steps, while ensuring precise patterning of inductors like uniaxial or toroid-shaped inductors.
Implementation Method 1
one or more magnets disposed on or embedded within at least one of the carrier plate and the shadow mask to create a magnetic field above the support surface
Data Source
AI summary
Methods and apparatus for a magnetized substrate carrier apparatus are described herein. In some embodiments, a substrate carrier apparatus includes: a carrier plate having a support surface to support a substrate, a mask assembly disposed above the support surface, wherein the mask assembly includes an annular frame and a shadow mask disposed within the annular frame, and wherein the shadow mask includes one or more openings arranged in a predetermined pattern and disposed through the shadow mask, and one or more magnets disposed on or embedded within at least one of the carrier plate and the shadow mask to create a magnetic field above the support surface.