Magnetizing Multiple Magnetic Circuits via Preliminary Assembly
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Solution Overview
Problem
The existing process for magnetizing multiple magnetic circuits in loudspeaker modules is inefficient due to the need for low-solidification-temperature adhesives, which result in low production efficiency and high costs, and the magnetic attraction between components complicates adhesive bonding.
Innovation Solution
A process where un-magnetized magnetic circuit assemblies are first assembled using adhesives and then magnetized using separate magnetizing coils, allowing for the selection of adhesives with higher solidification temperatures and reduced magnetic attraction during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If low-solidification-temperature adhesives are used to bond magnetized assemblies, then the adhesive can be applied, but the production efficiency decreases due to long solidification duration
Solution Approach 1:
The patent applies preliminary action by assembling the magnetic circuit components in an un-magnetized state before magnetization. This allows the use of high-temperature adhesives with short solidification times, as the adhesive bonding occurs before any heat treatment that would affect magnetism. The sequence is reversed from conventional methods: assembly first, then magnetization, enabling efficient production with standard adhesives.
2Ease of manufacture
If low-solidification-temperature adhesives are used, then the adhesive can bond the assemblies, but the adhesion force is insufficient to meet product requirements
Solution Approach 1:
The patent applies preliminary action by assembling the magnetic circuit components in an un-magnetized state before magnetization. This allows the use of high-temperature adhesives with short solidification times, as the adhesive bonding occurs before any heat treatment that would affect magnetism. The sequence is reversed from conventional methods: assembly first, then magnetization, enabling efficient production with standard adhesives.
3Manufacturing precision
If the magnetic circuit assemblies are magnetized before assembly, then the polarities can be set, but the magnetic attraction force increases the difficulty of adhesive bonding
Solution Approach 1:
The patent applies preliminary action by assembling the magnetic circuit components in an un-magnetized state before magnetization. This allows the use of high-temperature adhesives with short solidification times, as the adhesive bonding occurs before any heat treatment that would affect magnetism. The sequence is reversed from conventional methods: assembly first, then magnetization, enabling efficient production with standard adhesives.
Solution Approach 2:
The patent applies inversion by reversing the conventional sequence of operations. Instead of magnetizing components first and then assembling them (which creates magnetic attraction problems), the patent assembles components in an un-magnetized state and then magnetizes the assembled structure. This inverted approach eliminates magnetic attraction during bonding while achieving the desired polarity configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the magnetizing process, increases production efficiency, and enables the use of a wider range of adhesives with higher adhesion force and lower costs, while maintaining magnetic stability.
Implementation Method 1
an un-magnetized magnetic circuit assembly is magnetized by a magnetizing coil
Data Source
AI summary
A process for magnetizing multiple magnetic circuits. The process comprises the following steps: S1, fixing an un-magnetized internal magnetic circuit assembly (12) to an un-magnetized external magnetic circuit assembly (22), so as to assemble into an un-magnetized magnetic circuit assembly (32); and S2, magnetizing the un-magnetized magnetic circuit assembly (32) that is completed in the Step S1, in this step the un-magnetized internal magnetic circuit assembly (12) and the un-magnetized external magnetic circuit assembly (22) are magnetized respectively by using an internal magnetic circuit magnetizing coil (40) and an external magnetic circuit magnetizing coil (50), so as to complete the process for magnetizing multiple magnetic circuits.