Magneto-impedance Sensor with Dual-Substrate Coil Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electromagnetic impedance sensing devices face challenges in manufacturing due to the need for time-consuming alignment processes and difficulties in uniformly coating photoresists, leading to defocus issues and limitations in miniaturization and sensitivity enhancement.
Innovation Solution
The solution involves forming patterned conductive layers on two substrates, bonding them to create an accommodation space for a magneto-conductive wire, and encapsulating the wire with an insulating layer, eliminating the need for additional alignment steps and allowing for the formation of multiple coils, thereby simplifying the manufacturing process and enhancing sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magneto-conductive wire is fixed on ceramic substrate by alternatively stacking patterned conductive layers and patterned insulating layer, then induction coil circuit can be formed, but multiple individual alignment steps are required making the manufacturing process very time consuming
Solution Approach 1:
The patent divides the structure into two separate substrates: a first substrate containing the magneto-conductive wire and a second substrate containing the patterned conductive and insulating layers. This segmentation eliminates the need for repeated alignment steps between layers on the same substrate, as each substrate can be prepared independently and then bonded together, significantly reducing manufacturing time while maintaining circuit integrity.
2Reliability
If magneto-conductive wire is fixed on ceramic substrate, then induction coil circuit can be formed, but step height exists between wire and substrate making it difficult to uniformly coat photoresists
Solution Approach 1:
The patent moves the magneto-conductive wire to a separate substrate dimension, eliminating the step height problem on the photoresist coating surface. By placing the wire on the first substrate and forming the patterned layers on the second substrate, both surfaces remain flat and suitable for uniform photoresist coating, while the wire is still electrically connected to form the induction coil circuit.
3Reliability
If conductive layer and insulating layer fluctuate with shape of magneto-conductive wire, then induction coil circuit can be formed, but critical dimension becomes very difficult to be further miniaturized
Solution Approach 1:
The patent segments the fluctuating structure into separate substrates, allowing the patterned conductive and insulating layers to be formed with precise, uniform dimensions on the second substrate without being constrained by the wire's shape on the first substrate. This enables better control of critical dimensions and facilitates further miniaturization of the device.
4Measurement precision
If number of coils is increased to enhance sensitivity, then electromagnetic impedance sensing device sensitivity can be improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent creates a universal platform where multiple coils can be formed using the same fabrication process on the second substrate. The patterned conductive layers can be configured to create multiple independent or interconnected coils, allowing sensitivity enhancement through increased coil count without proportionally increasing manufacturing complexity, as the same layer stacking and bonding process applies regardless of coil number.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time, avoids photolithography defocus problems, enables miniaturization, and increases coil count, resulting in improved sensitivity and efficiency in producing electromagnetic impedance sensing devices.
Implementation Method 1
Magneto-impedance sensing device
Data Source
AI summary
An electromagnetic impedance sensing device includes a first substrate, a first patterned conductive layer, a second substrate, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The first substrate has a first surface, and the first patterned conductive layer is formed on the first surface. The second substrate has a second surface facing to the first surface, and the second patterned conductive layer is formed on the second surface and electrically contacted to the first patterned conductive layer. The first and second patterned conductive layers are physically integrated to define an accommodation space allowing the magneto-conductive wire passing there through. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers, respectively. At least one coil circuit surrounding the magneto-conductive wire is formed by the first and second patterned conductive layers.