Magneto-resistance Sensor with Fixed Resistor for Compact Integration
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Solution Overview
Problem
Existing magnetic detection devices using hall elements have complex circuit configurations and are not suitable for small devices due to their large size, while devices using magneto-resistance elements can detect magnetic fields with high precision but require a large area for integration.
Innovation Solution
A magnetic detection device with a multi-layered film structure using a magneto-resistance effect, where a magnetic detection element and a fixed resistance element are connected in series on a flat surface, integrated with a detection circuit on a substrate, allowing for compact integration and precise detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a hall element is used as a magnetic detection element, then the device can detect magnetic fields, but the circuit configuration becomes complex and the device size increases
Solution Approach 1:
The patent merges the magnetic detection element (using magneto-resistance effect) with the detection circuit into a single integrated structure on one substrate. The detection circuit includes signal processing components that are directly integrated with the magnetic detection element, eliminating the need for separate correction circuits required by hall elements. This integration simplifies the overall circuit configuration while maintaining detection precision.
2Measurement precision
If a hybrid IC with magnetic conversion IC chip and other circuit components is used, then the device can be integrated, but the area required for integration becomes large
Solution Approach 1:
The patent combines the magnetic detection element and the detection circuit onto a single substrate, forming a unified integrated structure. This eliminates the need for separate magnetic conversion IC chips and other discrete circuit components that would require additional space. The detection circuit is directly integrated with the magneto-resistance element, significantly reducing the overall area required for the magnetic detection device.
Solution Approach 2:
The patent employs multi-layered film structures and three-dimensional integration techniques to arrange circuit components vertically and horizontally on the substrate. By utilizing multiple layers and vertical stacking, the device achieves high integration density without proportionally increasing the planar area, thus reducing the overall footprint of the magnetic detection device.
3Ease of manufacture
If circuit components are two-dimensionally arranged on a substrate, then the device can be manufactured, but the IC chip size becomes relatively large
Solution Approach 1:
The patent transitions from two-dimensional arrangement to three-dimensional integration by employing multi-layered film structures. Circuit components are arranged across multiple layers with vertical interconnections, allowing compact packaging of functional elements. This three-dimensional architecture enables high-density integration while maintaining standard semiconductor fabrication processes, thus reducing IC chip area without compromising manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves high precision in detecting external magnetic fields with a compact design, reducing current consumption and enabling efficient integration on small devices while maintaining high output precision.
Implementation Method 1
a magnetic detection element with a multi-layered film structure in which an electric resistance varies with an external magnetic field using a magneto-resistance effect
Data Source
AI summary
A magnetic detection device of which an output can be completely switched over with an external magnetic field is formed in a small size. A detection circuit is formed by forming circuit elements such as an active element layer and interconnection layers on a substrate. An insulating layer is formed on the detection circuit, and a flat surface is formed on the resultant surface. A magnetic detection element that detects an external magnetic field by using a magneto-resistance effect and a fixed resistance element, which has the same electric resistance as the magnetic detection element but does not react to the external magnetic field, are formed on the flat surface. Electrode layers and a lead layer are formed on the flat surface, and the lead layer and the interconnection layer are electrically connected to each other via a bump penetrating the insulating layer. The magnetic detection element and the fixed resistance element are formed on the flat surface of the insulating layer, thereby forming a small magnetic detection device.


