Magneto-resistive Chip Package Shielding Structure
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Solution Overview
Problem
Magneto-resistive chips, such as MRAM, are vulnerable to data loss due to external magnetic fields, requiring an effective shielding structure to minimize their impact.
Innovation Solution
A magneto-resistive chip package with a shielding structure comprising a shielding base part, an intermediate part, and a cover, which can be designed with various configurations like L-shaped or T-shaped, to provide comprehensive protection while maintaining a thin profile and high shielding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding structure is added to protect the magneto-resistive chip from external magnetic fields, then the reliability of data storage is improved, but the thickness of the package increases
Solution Approach 1:
The shielding intermediate part is nested within the shielding base part, creating a multi-layer shielding structure that provides comprehensive magnetic field protection while optimizing space utilization. The intermediate part extends from one side of the base part to provide additional shielding coverage without requiring a complete enclosure, thus reducing overall thickness.
Solution Approach 2:
The shielding structure transitions from a traditional planar configuration to a three-dimensional configuration with the intermediate part extending vertically from the base part. This dimensional change allows the shielding to cover multiple layers and angles of magnetic field exposure, providing enhanced protection without proportionally increasing the horizontal footprint or overall package thickness.
2Reliability
If a shielding structure is added to protect the magneto-resistive chip from external magnetic fields, then the reliability of data storage is improved, but the shielding area is reduced
Solution Approach 1:
The intermediate part is positioned to extend from one side of the base part, creating a nested configuration that maximizes shielding coverage within the available space. This arrangement ensures that the shielding structure covers the magneto-resistive chip from multiple directions without requiring a complete enclosure, thus maintaining large shielding area while providing comprehensive protection.
3Length of stationary object
If the shielding structure is made thinner to reduce package thickness, then the package size is decreased, but the shielding effectiveness is reduced
Solution Approach 1:
The nested configuration of the intermediate part within the base part creates multiple shielding layers in a compact arrangement. This multi-layer structure provides enhanced magnetic field attenuation through cumulative shielding effects, achieving high shielding effectiveness without requiring each individual layer to be thick, thus maintaining thin overall profile.
Solution Approach 2:
The shielding structure utilizes magnetic material layers that can be integrated into the thin profile of the package. These specialized materials provide high magnetic permeability and shielding effectiveness in thin configurations, allowing the structure to maintain both thinness and effective magnetic field protection.
4Reliability
If openings or gaps are formed in the shielding body to allow internal connection, then the electrical connectivity is improved, but the shielding effectiveness is reduced
Solution Approach 1:
The openings or gaps are strategically positioned in specific locations of the shielding body where they are least likely to compromise overall shielding effectiveness. The internal connection part passes through these localized openings to establish electrical connectivity between the magneto-resistive chip and the circuit board, while the majority of the shielding structure remains intact to maintain magnetic field protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure effectively reduces the impact of external magnetic fields on the magneto-resistive chip, ensuring data integrity and allowing for compact, high-capacity data processing.
Implementation Method 1
a package including a magneto-resistive chip, namely, a magneto-resistive chip package, requires a shielding structure capable of substantially reducing the influence of the external magnetic field upon the magneto-resistive chip package
Data Source
AI summary
In one embodiment, a magneto-resistive chip package includes a circuit board; a shielding body including a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part and including a magneto-resistive cell array; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part encapsulating the magneto-resistive chip on the circuit board, and having an upper surface that is higher than an upper surface of the magneto-resistive chip; and a shielding cover positioned on the shielding intermediate part, and on the encapsulation part.