Magnetoelectric Element Nested Opening Design

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Solution Overview

Problem

Conventional Hall elements in magnetoelectric transducer modules suffer from stress concentration and moisture ingress, leading to performance degradation and reduced magnetic sensitivity due to solder-related issues.

Innovation Solution

A magnetoelectric converting element and module design featuring a substrate with a magnetosensitive layer, insulating layers, and terminal conductors, where the second openings are located inside the first openings, and a sealing resin surrounds the element to prevent stress concentration and moisture ingress, with an underlying conductive layer configuration that includes an erosion-resistant layer to prevent Sn and moisture ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If terminal conductors are bonded to module substrate by soldering, then electrical connection is established, but stress concentration occurs at bonded portions

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidstress resistance at bonded portions

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent transitions from a planar bonding structure to a three-dimensional nested opening structure. The second opening is positioned inside the first opening, creating a stepped configuration that distributes stress across multiple levels and reduces stress concentration at the bonding interface between terminal conductors and module substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bonding structure is divided into multiple segments with distinct openings. The first opening exposes the magnetosensitive layer for electrical connection, while the second opening (positioned inside the first) provides a separate bonding area. This segmentation allows stress to be distributed across different regions rather than concentrated at a single bonding point.

Inventive Principle:

Principle #1Segmentation

2Reliability

If solder is used for bonding terminal conductors, then electrical connection is achieved, but moisture and Sn ingress into Hall device occurs

Engineering Contradiction:

Improveelectrical connectionVSAvoidmoisture and Sn ingress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The second opening is nested inside the first opening, creating a protective layered structure. This nested configuration allows the magnetosensitive layer to be exposed for electrical connection while the surrounding insulating layers and the nested opening structure provide barriers that prevent moisture and Sn from the solder from reaching and infiltrating the Hall device.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Insulating layers are introduced as intermediary structures between the solder/bonding materials and the magnetosensitive layer. These insulating layers act as protective barriers that allow electrical connection to be maintained while preventing the harmful ingress of moisture and Sn into the sensitive Hall device regions.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional bonding structure is used, then manufacturing is simplified, but performance degradation occurs due to stress concentration

Engineering Contradiction:

Improvebonding process simplicityVSAvoidHall element performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a vertical dimension to the bonding structure by creating a nested opening arrangement where the second opening is positioned inside the first opening. This three-dimensional structure can be fabricated using standard semiconductor processing techniques such as photolithography and etching, maintaining ease of manufacture while significantly improving stress distribution and Hall element performance.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents stress concentration and moisture ingress, enhancing the magnetic field sensitivity and reliability of the magnetoelectric converting elements and modules by ensuring stable electrical connections and protecting against external forces and environmental factors.

Implementation Method 1

Hall-effect elements (simply, 'Hall elements' or 'Hall devices') are examples of magnetoelectric converting element. Configured to convert magnetic signals (or fields) into electric signals

Methodology Applied

Scientific EffectHall effect: Hall Effect

Data Source

PatentUS10141500B2Magnetoelectric converting element and module utilizing the same

Publication Date: 2018.11.27 ROHM CO LTD

AI summary

A magnetoelectric converting element includes a substrate, a magnetosensitive layer, a first insulating layer, an underlying conductive layer, a second insulating layer, and a terminal conductor. The magnetosensitive layer is formed on the substrate. The first insulating layer is formed with first opening for exposing a part of the magnetosensitive layer. The underlying conductive layer is formed on the exposed part of the magnetosensitive layer. The second insulating layer is formed with a second opening for exposing a part of the underlying conductive layer. The terminal conductor is formed on the exposed part of the underlying conductive layer. The second opening is arranged to be located inside the first opening in plan view.