Magnetoresistive Element Insulating Layer Prevents Short-Circuit
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Solution Overview
Problem
Magnetoresistive effect elements, such as hard disk drives and magnetic random access memories, face the challenge of short-circuit formation due to redeposit adherence on side surfaces during processing, which can lead to damage when attempting to cut the short-circuit path.
Innovation Solution
A magnetoresistive effect element design featuring a first magnetic layer, a nonmagnetic layer, a second magnetic layer, a first insulating layer on the side surface of the second magnetic layer, a second insulating layer covering part of the first insulating layer, and a conductive layer between the insulating layers, with the conductive layer's height ensuring it does not contact the upper electrode, preventing short-circuit formation without damaging the element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a magnetoresistive effect element is processed, then the element structure is formed, but redeposit adheres to side surfaces forming short-circuit paths
Solution Approach 1:
An insulating layer is introduced as an intermediary between the redeposit and the electrode. This insulating layer prevents direct contact between the conductive redeposit and electrode, thereby eliminating the short-circuit path while allowing the element structure to be formed as intended
Solution Approach 2:
The harmful conductive property of the redeposit is extracted or neutralized by covering it with an insulating layer. This removes the short-circuiting effect while preserving the structural integrity of the formed element
2Object-affected harmful factors
If the short-circuit path is cut, then the short-circuit is removed, but the element is damaged
Solution Approach 1:
Instead of cutting the short-circuit path after formation, an insulating layer is applied in advance to prevent the short-circuit from occurring. This preliminary protective action eliminates the need for subsequent cutting operations that would damage the element
Solution Approach 2:
The insulating layer serves as a mediator that prevents the harmful interaction between redeposit and electrode, allowing the short-circuit issue to be resolved without mechanical intervention that would compromise element strength
3Reliability
If the conductive layer height is increased, then connectivity is improved, but contact with upper electrode causes short-circuit
Solution Approach 1:
The second insulating layer acts as an intermediary barrier between the conductive layer and the upper electrode. This allows the conductive layer to maintain its connectivity function at increased heights without creating short-circuits, as the insulating layer prevents direct contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents short-circuit formation and ensures the integrity of the magnetoresistive effect element by maintaining the conductive layer's position between the insulating layers, thus avoiding damage during processing.
Implementation Method 1
Magnetoresistive effect elements using magnetism such as hard disk drives (HDD) and magnetic random access memories (MRAM) have been developed
Data Source
AI summary
According to one embodiment, a magnetoresistive effect element includes: a first magnetic layer; a nonmagnetic layer provided on the first magnetic layer; a second magnetic layer provided on the nonmagnetic layer; a first insulating layer provided at least on a side surface of the second magnetic layer; a second insulating layer covering at least a part of the first insulating layer; a conductive layer provided between the first insulating layer and the second insulating layer; and a first electrode including a first portion on the second magnetic layer and a second portion on a side surface of the second insulating layer. A height of a lower surface of the second portion is equal to or less than a height of an upper surface of the conductive layer.