Magnetoresistive Element With MnGa Storage Layer
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Solution Overview
Problem
Current magnetoresistive elements face challenges in achieving high-density, low-power nonvolatile memory integration due to high saturation magnetization and magnetic relaxation constants, as well as increased magnetic field leakage from smaller layers, which requires materials and methods to reduce interface roughness and diffusion.
Innovation Solution
A magnetoresistive element structure incorporating a MnGa alloy as the storage layer with a CsCl structured base layer, featuring a perpendicular magnetization type, low saturation magnetization, and low Gilbert damping constant, along with a tunnel barrier layer and interfacial magnetic layers to enhance spin polarizability and reduce diffusion, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of magnetoresistive elements is reduced to increase density, then memory density is improved, but magnetic field leakage increases
Solution Approach 1:
A nonmagnetic layer is introduced as an intermediary between the storage layer and reference layer to shield magnetic field leakage. This mediator layer prevents direct magnetic interaction between adjacent magnetoresistive elements, thereby reducing harmful magnetic field leakage while maintaining high memory density
Solution Approach 2:
The patent uses composite material structures including CoFeB alloy layers combined with specific insulating materials to create magnetoresistive elements with controlled magnetic properties. The composite structure allows optimization of both density and magnetic field confinement
2Use of energy by moving object
If the thickness of magnetic layers is reduced to lower saturation magnetization, then magnetization switching current is improved, but interface roughness and element diffusion increase
Solution Approach 1:
The patent optimizes the thickness parameters of magnetic layers to achieve a balance between reducing saturation magnetization and maintaining acceptable interface quality. By carefully controlling layer thickness within specific ranges, the invention achieves low switching current while minimizing interface roughness and element diffusion effects
Solution Approach 2:
The use of CoFeB alloy and other composite material systems provides better interface stability and reduced diffusion compared to conventional materials. The composite structure maintains low saturation magnetization while improving interface quality through material selection
3Reliability
If conventional magnetic materials are used in MTJ elements, then magnetoresistive effect is achieved, but write current density is high
Solution Approach 1:
The patent changes the magnetic material parameters by using CoFeB alloy and optimizing magnetization orientation to achieve perpendicular magnetic anisotropy. This parameter change enables spin transfer torque switching with significantly reduced current density while maintaining strong magnetoresistive effects
Solution Approach 2:
The invention utilizes phase transition concepts in the sense of switching between parallel and antiparallel magnetization states through spin transfer torque. The controlled phase transition of magnetization direction enables low-power writing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient magnetization switching with reduced current density and improved magnetic anisotropy, achieving high-density, low-power magnetoresistive random access memory (MRAM) with enhanced magnetoresistance ratios and reduced magnetic field leakage.
Implementation Method 1
This MTJ element is known to have a tunneling magnetoresistive (TMR) effect
Implementation Method 2
where a technique called spin transfer torque switching is used to control magnetization with a spin-polarized current
Data Source
AI summary
A magnetoresistive element according to an embodiment includes: a first layer containing Al and at least one element of Ni or Co, the first layer having a CsCl structure; a first magnetic layer; a first nonmagnetic layer between the first layer and the first magnetic layer; and a second magnetic layer between the first layer and the first nonmagnetic layer, the second magnetic layer containing Mn and Ga.


