Low Profile Magnetoresistive Sensor Array Spacing Reduction
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Solution Overview
Problem
Existing magnetoresistive imaging sensor arrays have a large spacing between the sensor array and the medium, leading to low spatial resolution and a low signal-to-noise ratio, making it difficult to distinguish small magnetic marks and resulting in blurred images.
Innovation Solution
The design optimizes the arrangement of integrated circuits and magnetoresistive sensing elements by mounting them on both surfaces of substrates and using through-the-chip interconnections to reduce the spacing between the sensor array and the medium, replacing traditional bonding pads and increasing the efficiency of electric connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional bonding pads are used for electric connections, then the structure is simple and easy to manufacture, but the spacing between the sensor array and the medium increases by 100 to 200 μm, resulting in low spatial resolution and low signal-to-noise ratio
Solution Approach 1:
The invention extracts and removes the traditional bonding pad structure from the connection path between the sensor array and the medium. By eliminating the bonding pad layer, the spacing between the sensor array and the medium is reduced by 100 to 200 μm, directly improving spatial resolution and signal-to-noise ratio while maintaining manufacturing simplicity through alternative direct connection methods
Solution Approach 2:
The invention transitions from a planar connection structure (bonding pads on the surface) to a three-dimensional integrated structure where connections are made through the substrate thickness. This dimensional change allows the sensor array to be positioned much closer to the medium, reducing the spacing by 100 to 200 μm and enabling high-resolution magnetic mark detection
2Reliability
If the spacing between the sensor array and the medium is large, then the structure is simpler and manufacturing is easier, but the signal-to-noise ratio decreases and image quality becomes poor
Solution Approach 1:
The invention changes the critical parameter of spacing distance from a large value (with bonding pads) to a small value (without bonding pads). By reducing the spacing between the sensor array and the medium by 100 to 200 μm, the magnetic field strength at the sensor increases, improving the signal-to-noise ratio and enabling reliable detection of small magnetic marks while using standard manufacturing processes
3Measurement precision
If bonding pads are used for electric connections, then the connection method is traditional and well-established, but the distance between the medium and the imaging sensor array increases by 50%, reducing imaging quality
Solution Approach 1:
The invention extracts and eliminates the bonding pad structure that was adding 100 to 200 μm to the overall distance. By removing this intermediate layer, the distance between the medium and the imaging sensor array is reduced by 50%, directly improving imaging quality and enabling the sensor array to detect magnetic marks with high precision
Solution Approach 2:
The invention performs preliminary integration of the sensor array with the substrate before final assembly, positioning the sensor array in optimal proximity to the medium from the outset. This preliminary action eliminates the need for bonding pads and ensures the minimum possible spacing is achieved, reducing the distance by 50% and optimizing imaging quality from the beginning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the distance between the medium and the imaging sensor array by 50%, enhancing spatial resolution, signal-to-noise ratio, and overall system compactness while maintaining durability and cost-effectiveness.
Implementation Method 1
at least one sensing element array, and the sensing element array comprising at least one magnetoresistive sensing element
Data Source
AI summary
A low profile magnetoresistive imaging sensor array based on the principle of magnetic induction, which reduces a distance between a medium imaging sensor array and a medium by optimizing the arrangement of an application integrated circuit and a sensing element array and using an electric connection technology which can reduce the distance between the medium imaging sensor array and the medium, thereby increasing the resolution of the existing medium imaging sensor. The low profile magnetoresistive imaging sensor array includes a sensing element array and an application integrated circuit, and also includes a circuit which provides a power for the sensing element array, a magnetoresistive sensing element array selection circuit, a signal amplification circuit, a digitizer, a memory circuit, and a microprocessor. Additionally, the sensing element array includes at least one magnetoresistive sensing element.