Magnetoresistive Sensor Element With Diluted Sense-Layer Compensation

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Solution Overview

Problem

Existing magnetoresistive sensors face significant challenges due to the temperature-dependent variation in sensitivity (TCS) that affect their performance and application range, necessitating complex electronic circuits for compensation, which increase die size and development complexity.

Innovation Solution

A magnetoresistive sensor element with a ferromagnetic sense layer containing a transition metal element in a specific proportion to compensate for the temperature dependence of susceptibility and tunnel magnetoresistance, eliminating the need for additional electronics and allowing for a smaller die size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complex electronic circuits are used to compensate for temperature dependence of sensitivity, then temperature stability is improved, but device complexity and die size increase

Engineering Contradiction:
Improvetemperature stabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the temperature compensation function from external electronic circuits and integrates it into the magnetoresistive sensor element itself through the second ferromagnetic sense portion. This eliminates the need for separate compensation circuits while maintaining temperature stability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the sensing function and temperature compensation function into a single integrated structure. The second ferromagnetic sense portion is coupled to both the tunnel barrier layer (for sensing) and configured to compensate temperature dependence (for stability), combining multiple functions in one component.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If complex electronic circuits are used to compensate for temperature dependence of sensitivity, then temperature stability is improved, but die size increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoiddie size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent removes the need for external temperature compensation circuits, thereby eliminating the additional die area they would occupy. The compensation function is extracted and embedded within the sensor element's magnetic layer structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

By merging the compensation function into the existing sensor structure, the patent avoids adding separate compensation circuitry that would increase die size. The second ferromagnetic sense portion serves dual purposes: sensing and temperature compensation.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If additional electronics are added for temperature compensation, then sensitivity consistency is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvesensitivity consistencyVSAvoidmanufacturing simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the temperature compensation function from external electronics and embeds it in the magnetic layer structure, which can be manufactured using standard thin-film deposition techniques already employed in magnetoresistive sensor fabrication.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the compensation function with the sensing structure, allowing both to be fabricated in the same manufacturing process sequence without requiring additional electronics assembly or testing steps.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves minimal temperature dependence of sensitivity, ensuring consistent performance across varying temperatures without additional electronics, thus simplifying manufacturing and reducing die size.

Implementation Method 1

The resistance depends on the relative orientation of the sense magnetization and the reference magnetization

Methodology Applied
Scientific EffectTunnel magnetoresistance: Magnetoresistance

Implementation Method 2

a ferromagnetic reference layer 23 including a first ferromagnetic layer 231 having a first reference magnetization 234 and a second ferromagnetic layer 232 having a second reference magnetization 235

Methodology Applied
Scientific EffectFerromagnetism: Ferromagnetism

Data Source

PatentEP3862769B1Magnetoresistive sensor element having compensated temperature coefficient of sensitivity and method for manufacturing said element
Publication Date: 2025.10.22 CROCUS TECHNOLOGY
  • EP3862769B1 patent drawingFigure 1~2b
  • EP3862769B1 patent drawingFigure 3~4b
  • EP3862769B1 patent drawingFigure 5~6(c)

AI summary

The present disclosure concerns a magnetoresistive sensor element (2) comprising: a reference layer (23) having a pinned reference magnetization (230); a sense layer (21) having a free sense magnetization (210) comprising a stable vortex configuration reversibly movable in accordance to an external magnetic field (60) to be measured; a tunnel barrier layer (22) between the reference layer (23) and the sense layer (21); wherein the sense layer (21) comprises a first ferromagnetic sense portion (211) in contact with the tunnel barrier layer (22) and a second ferromagnetic sense portion (212) in contact with the first ferromagnetic sense portion (211); the second ferromagnetic sense portion (212) comprising a dilution element in a proportion such that a temperature dependence of a magnetic susceptibility (χ) of the sense layer (21) substantially compensates a temperature dependence of a tunnel magnetoresistance of the magnetoresistive sensor element. The present disclosure concerns a method for manufacturing the magnetoresistive sensor element.