Magnetron Calibration Using Magnetic Field Mapping in PVD

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Solution Overview

Problem

Manual calibration of magnetron distance in PVD equipment is inefficient and inaccurate, leading to degraded deposition performance in semiconductor manufacturing, as it relies on manual inspection and does not account for varying deposition applications.

Innovation Solution

A calibration method using sensors to map magnetic field positions and distances, model film production parameters, and select optimal elevations for magnetron installation, incorporating AI data training for improved accuracy and repeatability, with a calibration apparatus featuring motors and sensors for precise measurement and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual calibration of magnetron distance is performed in PVD equipment, then the calibration process is simple to implement, but the accuracy and repeatability of calibration are degraded

Engineering Contradiction:

Improvecalibration process simplicityVSAvoidmagnetron distance measurement accuracy

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces manual mechanical measurement methods with an automated optical measurement system. A camera captures images of the magnetron and target, and image processing algorithms automatically calculate the magnetron-to-target distance, eliminating manual measurement errors and improving precision while maintaining ease of operation through automated processing.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates a visual copy (image) of the physical magnetron and target assembly using a camera. This optical copy allows for precise digital measurement and analysis without physical contact, enabling accurate distance calculation while simplifying the calibration process through non-intrusive optical sensing.

Inventive Principle:

Principle #26Copying

2Device complexity

If manual inspection methods are used for magnetron calibration, then the equipment complexity is low, but the deposition performance and film uniformity are degraded

Engineering Contradiction:

Improvecalibration equipment simplicityVSAvoidfilm uniformity and deposition quality

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent replaces simple mechanical inspection with an optical measurement and image processing system. The camera-based system captures detailed visual information about the magnetron and target alignment, enabling precise calculation of critical dimensions that directly affect film uniformity, while the automated image processing maintains relatively low equipment complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent implements a feedback mechanism where the measured magnetron-to-target distance and alignment data are used to adjust and optimize the deposition process parameters. This closed-loop approach ensures that film uniformity and deposition quality are maintained at optimal levels by continuously referencing the actual measured geometry.

Inventive Principle:

Principle #23Feedback

3Productivity

If generic calibration procedures are used, then the calibration process is quick and simple, but the accuracy for varying deposition applications is degraded

Engineering Contradiction:

Improvecalibration speedVSAvoidcalibration accuracy for different deposition applications

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent implements a dynamic calibration approach where the measurement system automatically adapts to different deposition applications. The image processing algorithms can adjust measurement parameters and analysis methods based on the specific application requirements, allowing the same hardware system to maintain high accuracy across varying deposition scenarios without requiring manual reconfiguration.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent enables parameter changes in the calibration process by allowing the image processing system to adjust measurement thresholds, analysis algorithms, and evaluation criteria based on the specific deposition application. This flexibility maintains calibration speed while improving adaptability to different material systems and deposition conditions.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the accuracy and repeatability of magnetron calibration, ensuring optimal film characteristics and uniformity during PVD operations, thereby improving semiconductor device fabrication consistency and efficiency.

Implementation Method 1

Magnetic field intensities at different elevations above the magnetron are measured

Methodology Applied

Scientific EffectMagnetic field measurement: Magnetic Field

Data Source

PatentUS11747131B2Measuring method and semiconductor structure forming method

Publication Date: 2023.09.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.