Magnetron Assembly with Self-Powered Dynamic Magnet Control
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Solution Overview
Problem
Existing magnetron systems face challenges in achieving uniform sputtering due to inaccuracies in the adjustment of the magnetic field, which affects the deposition characteristics of the target material, and are prone to electrical fluctuations and maintenance issues.
Innovation Solution
A compact, reliable, and less complex electrical interaction chain is implemented, with multiple magnet system groups and a generator that produces power within the rotating target, reducing energy consumption and enhancing maintenance intervals, allowing for precise adjustment of the magnetic field.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronics are used to generate the magnetic field, then the magnetron system can operate, but the electronics are prone to failure and too cumbersome due to water exposure and electrical fluctuations
Solution Approach 1:
The rotating target itself generates electrical energy through electromagnetic induction, eliminating the need for external power cables and electronics inside the water environment. The target acts as a generator, converting its rotational motion into electrical energy that powers the magnetic field generation and control systems, making the system self-sufficient and reducing failure points
Solution Approach 2:
The patent extracts the power generation function from the vulnerable electronics and relocates it to the rotating target. By taking out the need for complex electrical interaction chains that pass through water, the system eliminates the source of reliability problems while reducing overall system complexity
2Productivity
If the magnet system is positioned to form a plasma channel on the target surface, then plasma formation is enhanced, but precise alignment is required to maintain uniform atomization as target material is consumed
Solution Approach 1:
The patent implements dynamic adjustment of the magnet system position relative to the target surface. As the target material is consumed and the surface recedes, the magnet system automatically adjusts its position to maintain the optimal gap for plasma channel formation and uniform magnetic field distribution, ensuring consistent atomization throughout the sputtering process
Solution Approach 2:
The system incorporates feedback mechanisms that monitor the target surface position and magnet alignment in real-time. Based on this feedback, the control system adjusts the magnet system position to maintain precise alignment with the plasma channel, ensuring uniform atomization even as the target geometry changes during operation
3Duration of action of moving object
If energy is generated within the rotating target, then the energy supply chain is shortened and maintenance intervals are extended, but the energy consumption required to adjust the magnetic field must be reduced
Solution Approach 1:
The magnet system is divided into multiple independent magnet modules that can be individually adjusted and controlled. This segmentation allows the system to use only the minimum necessary energy to adjust individual magnet positions rather than repositioning the entire magnetic field system, reducing overall energy consumption while maintaining precise magnetic field control
Solution Approach 2:
The patent optimizes the magnetic field adjustment parameters to minimize energy consumption. By using incremental position changes and optimizing the adjustment speed and force applied to each magnet, the system reduces the energy required for magnetic field reconfiguration while still achieving the desired alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures more uniform sputtering, reduces the risk of failures, and facilitates repairs by providing a more reliable and efficient power supply, leading to improved layer deposition characteristics.
Implementation Method 1
an electrical generator (308) configured to provide electrical power based on a rotational movement of the target and to supply it to the actuator
Implementation Method 2
Plasma formation can be enhanced by a magnetic field, which can, for example, increase the ionization rate of the plasma-forming gas. To generate the magnetic field, a magnet system can be positioned relative to the cathode
Implementation Method 3
a plasma-forming gas is ionized by a cathode, and the resulting plasma atomizes the target material
Implementation Method 4
cathode sputtering. Sputtering can be used to deposit one or more layers onto a substrate. For this process, a plasma-forming gas is ionized by a cathode, and the resulting plasma atomizes the target material
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
According to various embodiments, a magnetron arrangement may comprise: a bearing arrangement comprising a support (102) for rotatably supporting a tubular target (302) into which the support (102) extends; one or more than one magnet system group (150), each of which comprises: an optional backplate (202), at least two magnets (104), an electrical actuator configured to position the backplate (202) and/or the at least two magnets (104) relative to the support (102) in response to an electrical control signal supplied to the actuator; an optional electrical generator (308) configured to convert a rotational movement of the target (302) into electrical power and supply it to the actuator;a communication interface (602) which is configured to supply the electrical control signal to the actuator in a clocked manner according to the rotational movement of the target (302); wherein the communication interface (602) has a variable capacitor which is coupled to the rotational movement.