Magnetron Sputter Plasma Confinement via Shared Magnetic Field
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Solution Overview
Problem
Current magnetron sputter deposition systems face challenges in achieving good plasma and electron confinement, especially when using targets with restricted dimensions, leading to difficulties in maintaining high plasma density and deposition rates during reactive processes.
Innovation Solution
A magnetron sputter deposition system with at least two sputter units and an additional magnet configuration positioned outside the target mounting elements, creating a shared plasma configuration where magnetic field lines from multiple magnet configurations contribute to plasma confinement and electron acceleration across both targets, allowing for higher plasma density and deposition rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple magnetron sputter units are used to increase deposition rate and yield, then productivity is improved, but plasma confinement becomes more difficult and plasma density decreases
Solution Approach 1:
The patent combines multiple magnetron units (first and second magnetron sputter units) into a single integrated system where the magnet configurations interact to create a shared plasma region. The magnetic field lines from both magnetrons are merged and confined by the common magnetic configuration, allowing plasma to be sustained across multiple targets simultaneously. This merging approach enables high deposition rates from multiple targets while maintaining good plasma confinement through the unified magnetic field structure.
2Device complexity
If targets with restricted dimensions are used, then device complexity is reduced, but plasma confinement and electron confinement become insufficient
Solution Approach 1:
The patent extends the magnetic confinement from a two-dimensional planar configuration to a three-dimensional volume by positioning the common magnetic configuration to confine plasma and electrons in the space between multiple targets. The magnetic field lines are arranged to create a volumetric confinement region that encompasses the restricted-dimension targets, enhancing electron confinement and plasma density without requiring larger target dimensions. This dimensional extension of the magnetic field provides effective confinement for small, compact targets.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables higher plasma density and deposition rates compared to traditional systems, with improved target utilization and reduced target erosion, while maintaining a stable magnetic field and compact system design.
Implementation Method 1
A magnet system may be provided under the target surface to confine the free electrons in a racetrack. Within the racetrack the ionization degree of the gas is greatly increased and the ion bombardment of the target is therefore more intense below the racetrack.
Implementation Method 2
In a low-pressure sputter deposition coater, ionized gas ions are accelerated towards a negatively biased target. Atoms are kicked out of the target when the gas ions impinge on its surface.
Implementation Method 3
The knocked-out atoms hit the substrate surface where a dense coating forms. Such a process is known as magnetron sputter deposition.
Data Source
Figure 1~2A
Figure 2B~2C
Figure 2D~2E
AI summary
A sputter deposition magnetron system for sputtering material, the sputter deposition magnetron system comprising at least a first and a second sputter magnetron unit. Each of the magnetron units (102, 106) comprise a magnet configuration and a mounting element for mounting a target (101, 105) so that the first and second magnet configuration contribute to the formation and confinement of a plasma allowing sputtering of the first respectively second target (101, 105). The sputter deposition magnetron system furthermore comprises at least one extra magnet configuration (103) distanced from the mounting element for targets, whereby the first, the second and the at least one magnet configuration are arranged for each contributing to a confined plasma configuration wherein at least part of the plasma is shared across the first and the second sputter magnetron unit.