Magnetron Sputter Ion Plating Electron Trapping
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Solution Overview
Problem
Magnetron sputter ion plating systems face challenges in achieving sufficient ionization intensity to deposit dense coatings, as existing methods often result in low ionization levels, especially when using balanced or unbalanced magnetrons with moderate outer magnet strength.
Innovation Solution
The system employs a configuration with at least two magnetrons or magnet assemblies, where the outer portions have opposite polarities, forming a magnetic flux that traps electrons and prevents their escape, combined with electric field means directing an electric field towards the substrate, which is held at a negative potential, to enhance ionization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If additional filaments and electrodes are used to provide ionisation enhancement, then ionisation intensity increases, but device complexity increases
Solution Approach 1:
The magnetron system itself serves as the ionisation source by using its magnetic field to trap electrons and enhance ionisation in the vicinity of the substrate, eliminating the need for separate ionisation enhancement devices such as filaments and electrodes
Solution Approach 2:
The magnetron system performs multiple functions: it serves as both the vapour source for material deposition and the ionisation source for generating ions to bombard the substrate, combining functions that were previously required from separate components
2Quantity of substance
If outer magnets are made exceptionally strong to increase ionisation intensity, then ionisation intensity increases, but device complexity and cost increase
Solution Approach 1:
The system merges the magnetic fields of adjacent magnetrons by arranging outer magnets of opposite polarity to form continuous magnetic flux lines that extend between magnetrons, creating a unified electron-trapping structure that enhances ionisation without requiring exceptionally strong individual magnets
Solution Approach 2:
The magnetic field structure acts as a composite system where the combined effect of multiple moderate-strength magnets creates a unified magnetic flux pattern that traps electrons more effectively than a single strong magnet would
3Productivity
If magnetron sputtering is used as vapour source in ion plating, then deposition rate increases, but ionisation intensity remains insufficient for dense coatings
Solution Approach 1:
The magnetron sputtering system enhances its own performance by using its magnetic field to trap electrons and generate ionisation in the substrate vicinity, allowing it to simultaneously provide both vapour deposition and ion bombardment functions
Solution Approach 2:
The system changes the operational parameters by applying negative bias to the substrate, which attracts ions generated by the magnetron's electron-trapping effect, thereby increasing ion bombardment intensity while maintaining high deposition rates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases ionization intensity, allowing for the deposition of dense and high-quality coatings with improved adhesion and structure, even with moderate magnet strengths, and is effective for various coating materials like titanium nitride and CrAlTiN.
Implementation Method 1
magnetic field means, the magnetic field means comprising at least two magnetrons and/or magnet assemblies each having an inner portion and an outer portion of opposite polarity
Implementation Method 2
It is known that the intensity of the glow discharge can be increased significantly by a magnetron effect, which causes the ionisation electrons to be trapped in a region where the electric field is crossed by an added magnetic field
Implementation Method 3
electric field means for producing an electric field directed towards at least one substrate to be coated
Implementation Method 4
the at least one substrate is held at a negative electrical potential of up to -1000 Volts
Implementation Method 5
Sputtering is a well known process in which a cathode of a glow discharge is made a target for ions produced in the glow discharge in a surrounding low-pressure gas. The ions are accelerated towards the target by an electric field and the impact of them on the target displaces particles of the surface of the target; these particles are deposited on the surface of a suitably placed substrate to form the coating
Implementation Method 6
Ion plating is a well known process in which a metal vapour produced in a vacuum system is deposited onto a substrate whilst, simultaneously, the substrate is bombarded with ions. The ion bombardment improves both the adhesion and the structure of the coating
Data Source
Figure 1a~2
Figure 1b
Figure 3~5
AI summary
The invention relates to apparatus and a method which allows the creation and maintenance of a closed field system in which magnetrons and/or magnet assemblies are provided in a form to create a magnetic field around an area in which the substrate to be coated is located. The method also relates to the steps of cleaning the substrates and applying an adhesive layer prior to the material which is to form the coating.