Magnetron Sputter Deposition System With Shared Plasma
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Solution Overview
Problem
In multiple magnetron sputter deposition systems, achieving uniform sputtering across all units is challenging due to differences in impedance, leading to unequal power distribution and potential suppression of some magnetron units during DC powering, which complicates reactive process control and increases system complexity and costs.
Innovation Solution
The system connects all magnetron units to a single power supply, allowing them to share a common plasma and magnetic field lines, ensuring balanced current distribution and self-regulating behavior, even when using DC power, and incorporates a virtual anode to prevent anode contamination and maintain efficient sputtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate DC power supplies are used for each magnetron unit, then high output and effective sputtering is achieved, but system complexity and cost increase
Solution Approach 1:
Multiple magnetron units are electrically connected in parallel to a single DC power supply, merging their electrical connections. This reduces the number of power supplies from multiple to one, simplifying the system while maintaining high sputtering output through the combined effect of all magnetron units operating simultaneously.
Solution Approach 2:
A single DC power supply is designed to universally power multiple magnetron units through parallel connection. The power supply serves multiple functions by providing electrical power to all magnetron units simultaneously, eliminating the need for separate dedicated power supplies for each unit.
2Device complexity
If a single power supply is used for multiple magnetron units, then system complexity is reduced, but unequal impedance causes unequal power distribution and suppression of some units
Solution Approach 1:
All magnetron units are connected in parallel to the same DC power supply, ensuring they operate at the same electrical potential. This equipotential connection allows each magnetron unit to receive appropriate power based on its impedance characteristics, preventing suppression while maintaining simple system architecture.
Solution Approach 2:
Each magnetron unit automatically receives the appropriate amount of power based on its own impedance characteristics when connected in parallel. The system self-regulates power distribution without requiring external control mechanisms, as each unit draws current according to its inherent electrical properties.
3Productivity
If DC power supply is used for high output, then sputtering efficiency is improved, but reactive process control becomes more difficult
Solution Approach 1:
The parallel connection of multiple magnetron units to a single DC power supply creates a feedback mechanism where the total current draw automatically adjusts based on the combined impedance of all units. This provides inherent control stability for reactive processes, as changes in one unit's impedance (due to reactive gas introduction) are compensated by the system as a whole.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient, controllable sputtering with a single power source, reducing system complexity, maintaining optimal performance across all units, and avoiding the need for separate power supplies, thus enhancing production efficiency and reducing maintenance requirements.
Implementation Method 1
the at least two magnetron sputter units are simultaneously electrically connected to the same electrode of the power supply
Implementation Method 2
A magnet system may be provided under the target surface to confine the free electrons in a racetrack
Implementation Method 3
ionized gas ions are accelerated towards a negatively biased target. Atoms are kicked out of the target when the gas ions impinge on its surface
Implementation Method 4
Atoms are kicked out of the target when the gas ions impinge on its surface
Implementation Method 5
the magnetron sputter units are arranged so that they at least partly share a common plasma in the region between the at least two magnetron sputter units during sputtering
Implementation Method 6
When also reactive gasses are admitted into the coater, reactions with the impinging target atoms will occur at the surface of the substrate, enabling the formation of compound materials such e.g. as oxides or nitrides
Data Source
Figure 1(A)~1(C)
Figure 2~3
Figure 4~5
AI summary
A magnetron sputter deposition system (100) for sputtering material is described. The system comprises at least two magnetron sputter units (102, 104), a power supply (110) for providing a power, the power supply (110) comprising an electrode wherein the at least two magnetron sputter units (102, 104) are simultaneously electrically connected to the same electrode of the power supply (110), and the magnetron sputter units are arranged so that they at least partly share a common plasma in the region between the at least two magnetron sputter units (102, 104).