Magnetron Sputter Source with Adjustable Magnet Loops
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Solution Overview
Problem
Achieving uniform distribution of layer thickness on large surface substrates during magnetron sputtering is challenging due to target erosion, which dynamically changes coating conditions over time, leading to inconsistent sputter rates and layer thickness distributions.
Innovation Solution
The method involves adjusting the distance of parts of the magnet arrangement along the target's backside using a controlled lift drive to maintain constant sputter power and optimize the distribution of the magnetron magnetic field, allowing for in-situ setting of the sputter rate distribution and layer thickness homogeneity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the magnet arrangement is stationary relative to the target, then the device complexity is reduced, but the layer thickness distribution becomes non-uniform due to target erosion over time
Solution Approach 1:
The magnet arrangement is made dynamically adjustable relative to the target surface. The distance between the magnet loops and the target can be changed during the coating process to compensate for target erosion, thereby maintaining uniform layer thickness distribution over time without requiring complex moving mechanisms
Solution Approach 2:
The distance parameter between the magnet arrangement and the target is made variable. By adjusting this parameter during the coating process, the magnetic field distribution is optimized to compensate for target erosion, ensuring uniform coating thickness while keeping the overall device structure relatively simple
2Productivity
If the magnet loops are positioned close to the target to increase sputter rate, then the productivity is improved, but eddy current losses increase
Solution Approach 1:
The distance between the magnet loops and the target is made dynamically adjustable. During the coating process, this distance can be optimized to balance the sputter rate and eddy current losses, allowing high productivity while minimizing energy waste from eddy currents
Solution Approach 2:
The distance parameter between magnet loops and target is varied to optimize the balance between sputter rate and eddy current losses. By changing this parameter, the system achieves high productivity with reduced energy losses
3Manufacturing precision
If the magnet arrangement is moved along the target to maintain uniform coating over time, then the layer thickness uniformity is improved, but the device complexity and operational difficulty increase
Solution Approach 1:
The magnet arrangement incorporates adjustable components that allow the distance to the target to be changed during operation. This dynamic adjustment capability enables uniform coating thickness over time while maintaining relatively simple operation through controlled parameter changes rather than complex mechanical movements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a uniform layer thickness distribution over the target's lifetime by controlling the magnet loop distances, reducing eddy current losses and maintaining consistent sputter power, thereby optimizing target utilization and layer thickness uniformity.
Implementation Method 1
at least one closed loop of a tunnel shaped magnetic field H is generated along the sputter surface 3S of the target 3 by means of a magnet arrangement 5 provided along the back side 3R of the target 3
Implementation Method 2
Due to the magnetron magnetic field H and the electric field E the known electron trap effect in the area of the tunnel shaped magnetron magnetic field H occurs, what there leads to an increased plasma density and an increased sputter effect
Implementation Method 3
the electric field E generated between the anode and the target 3 interconnected as the cathode. Due to the magnetron magnetic field H and the electric field E the known electron trap effect occurs
Implementation Method 4
an over the operation time increasing deeper circumferential erosion trench in the sputter surface 3s
Implementation Method 5
because of the target erosion the coating circumstances are dynamical i.e. change during the life time
Data Source
AI summary
Method for manufacturing magnetron coated substrates, in which along the target and on its backside pointing from the substrate, a magnet arrangement is present by which along the sputter surface of the target at least one closed loop of a tunnel shaped magnetron magnetic field is generated, characterized in that for setting the sputter rate distribution the distance of a part of the magnet arrangement to the backside of the target is changed.