External Main Terminal Layout for Insulated Overlapping Lead Frames
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently integrating collector and emitter electrode joint portions and lead frames due to overlapping configurations, which can lead to electrical interference and reduced efficiency.
Innovation Solution
The semiconductor device incorporates a design with a first and second main terminal formed in an integral manner, featuring planar trapezoidal lead frames with oblique or vertical substrate connections, allowing for a predetermined gap between them, enhancing electrical insulation and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If lead frames are arranged in overlapping configurations to integrate collector and emitter electrode joint portions, then device integration is improved, but electrical interference and reduced efficiency occur
Solution Approach 1:
The lead frames are segmented into distinct first and second lead frames with separate substrate connection portions. The first substrate connection portion connects to a first electrode joint portion while the second substrate connection portion connects to a second electrode joint portion, physically separating the electrical pathways to eliminate interference while maintaining integration.
Solution Approach 2:
The patent transitions from planar overlapping lead frame arrangements to a three-dimensional configuration where lead frames are positioned at different heights above the substrate. The first lead frame is positioned at a first height and the second lead frame at a second height, using vertical spacing to prevent electrical interference while achieving integration.
2Area of stationary object
If lead frames are positioned close together for compact design, then space utilization is improved, but electrical insulation deteriorates
Solution Approach 1:
The patent employs vertical positioning to achieve electrical insulation while maintaining compact horizontal footprint. Lead frames are arranged at different heights (first height and second height) above the substrate, creating three-dimensional spacing that provides adequate insulation distance without increasing planar area.
Solution Approach 2:
The substrate serves as an intermediary insulating layer between the first and second electrode joint portions. The substrate connection portions are positioned at different locations on the substrate, using the substrate material itself as the insulating medium that separates the electrical pathways while allowing compact integration.
Data Source
AI summary
An external connection main terminal includes a P main terminal and an N main terminal. The P main terminal includes an external terminal, a horizontal portion of a planar trapezoidal shape parallel to an insulated circuit substrate, and a connection terminal extending obliquely or vertically from the horizontal portion toward the insulated circuit substrate. The N main terminal includes an external terminal, a horizontal portion of a planar trapezoidal shape parallel to the insulated circuit substrate and being located over the horizontal portion of the P main terminal so that the horizontal portions of the P and N main terminals are superimposed over each other with a predetermined gap between in a direction orthogonal to the insulated circuit substrate, and a connection terminal extending obliquely or vertically from the horizontal portion toward the insulated circuit substrate.