Maintenance Plate Temperature Control with Reversible Fluid Flow
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Solution Overview
Problem
Existing temperature control systems in plasma processing devices experience uneven temperature distribution and potential damage due to rapid temperature changes during transitions between low and high temperatures, which can reduce productivity and risk component damage.
Innovation Solution
A temperature control system with a distribution-direction switching unit that controls the direction of fluid flow to manage temperature transitions by distributing low-temperature fluid from the central side to the outer circumferential side and high-temperature fluid from the outer circumferential side to the central side, using chillers to maintain stable temperature gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluids with wide temperature range are switched rapidly to increase etching rate and removal efficiency, then productivity is improved, but temperature distribution becomes uneven and components may be damaged due to thermal stress
Solution Approach 1:
The patent applies local quality by controlling the fluid distribution direction dynamically: when increasing temperature, fluid is distributed from central side to outer circumferential side; when decreasing temperature, fluid is distributed from outer circumferential side to central side. This directional control creates localized temperature gradients that match the thermal stress characteristics of the maintenance plate, preventing uneven temperature distribution and component damage while maintaining high productivity
2Reliability
If fluid temperature is changed gradually to reduce unevenness in temperature distribution, then component damage is prevented, but temperature control time increases which reduces productivity
Solution Approach 1:
The patent applies dynamics by making the fluid distribution direction changeable based on temperature control needs. The distribution-direction switching unit dynamically adjusts the fluid flow direction according to whether temperature is increasing or decreasing, enabling rapid temperature changes without causing uneven temperature distribution. This dynamic adaptation allows both fast temperature control and component protection simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal stress on components, prevents damage, and shortens temperature control time, thereby enhancing productivity and maintaining component integrity during plasma etching processes.
Implementation Method 1
a first chiller configured to supply a first fluid controlled to a first temperature, a second chiller configured to supply a second fluid controlled to a second temperature different from the first temperature
Implementation Method 2
a temperature control base bonded to a bottom of a maintenance plate in the vacuum chamber, the temperature control base including a flow path through which fluid is distributed
Data Source
AI summary
A temperature control system includes a temperature control base bonded to a bottom of a maintenance plate, a first chiller configured to control a temperature of a first fluid, a second chiller configured to control a temperature of a second fluid, a temperature control unit configured to heat or cool the first fluid or the second fluid flowing into a flow path defined in the temperature control base to have a target temperature, and a distribution-direction switching unit configured to control a distribution direction of each fluid. The distribution-direction switching unit distributes the second fluid in a first direction from a central side of the temperature control base toward an outer circumferential side in a temperature raising operation, and distributes the first fluid in a second direction opposite to the first direction in a temperature lowering operation.