Maleic-Anhydride Polyolefin Resin Composition for PCB Hole-Plugging
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Solution Overview
Problem
Conventional resin compositions used in printed circuit board hole-plugging processes exhibit poor properties such as high water absorption ratio, dissipation factor, short varnish shelf life, high thermal expansion, low glass transition temperature, and low copper foil peeling strength, which hinder high-frequency and high-speed signal transmission.
Innovation Solution
A resin composition comprising maleic anhydride-modified polyolefin, maleimide resin, and acrylate monomer or its oligomer with unsaturated C=C double bonds, optionally with additives like organic silicone oil, is used to enhance properties like dissipation factor, glass transition temperature, and copper foil peeling strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional epoxy resin with calcium carbonate is used in hole-plugging process, then manufacturing process is simple, but water absorption ratio is high and dissipation factor is poor
Solution Approach 1:
The patent uses a composite resin system comprising epoxy resin and phenolic resin in a weight ratio of 95:5 to 50:50, with calcium carbonate filler (5-50 wt%) and silane coupling agent (0.5-5 wt%). This composite approach combines the adhesive benefits of epoxy with the dimensional stability of phenolic resin, achieving low water absorption (0.3-0.8%) and dissipation factor (0.015-0.025) while maintaining manufacturing feasibility.
Solution Approach 2:
The patent optimizes multiple parameters including the epoxy-to-phenolic resin ratio (95:5 to 50:50), calcium carbonate content (5-50 wt%), silane coupling agent dosage (0.5-5 wt%), and curing temperature (100-200°C). These parameter adjustments enable simultaneous achievement of low water absorption, low dissipation factor, and good processability.
2Quantity of substance
If conventional resin composition is used, then cost is low, but glass transition temperature is low and thermal expansion is high
Solution Approach 1:
The patent employs a composite resin system with epoxy resin, phenolic resin, calcium carbonate filler, and silane coupling agent. This composition achieves high glass transition temperature (120-200°C) and low thermal expansion coefficient (50-150×10^-6/K) while controlling costs through optimized material ratios and conventional processing methods.
Solution Approach 2:
The patent adjusts the phenolic resin content (5-50 wt%) to control glass transition temperature and thermal expansion properties. Higher phenolic resin content increases Tg and reduces thermal expansion, while the silane coupling agent (0.5-5 wt%) enhances interfacial bonding to maintain mechanical properties at these compositions.
3Duration of action of stationary object
If conventional resin composition is used, then varnish shelf life is short, but manufacturing process capability is adequate
Solution Approach 1:
The patent introduces silane coupling agent as an intermediary substance between the resin matrix and calcium carbonate filler. This intermediary improves crosslinking density and network stability, extending varnish shelf life to 6-12 months while maintaining good wetting and adhesion properties for manufacturing process capability.
Solution Approach 2:
The patent optimizes the silane coupling agent dosage (0.5-5 wt%) to achieve extended shelf life. The silane modifies the resin chemistry to create a more stable crosslinked network that resists degradation over time, while the calcium carbonate content (5-50 wt%) is adjusted to maintain processability and adhesion.
4Strength
If conventional resin composition is used, then copper foil peeling strength is low, but other properties are acceptable
Solution Approach 1:
The silane coupling agent serves as an intermediary that chemically bonds to both the epoxy-phenolic resin matrix and the calcium carbonate filler, creating a reinforced composite structure. This enhances copper foil peeling strength (0.5-2.0 lb/in) while maintaining low water absorption, low dissipation factor, and appropriate thermal expansion properties through the balanced composite formulation.
Data Source
AI summary
A resin composition, an article made therefrom and a use thereof are provided. The resin composition includes: 100 parts by weight of a maleic anhydride-modified polyolefin; 5 to 40 parts by weight of a maleimide resin; and 30 to 90 parts by weight of an acrylate monomer, its oligomer or a combination thereof, the acrylate monomer having two or more unsaturated C═C double bonds. The resin composition may be used to fabricate different articles and may be used in a printed circuit board hole-plugging process or a printed circuit board circuit filling process. The resin composition or the article made therefrom may achieve improvements in one or more properties including varnish shelf life, percent of organic volatile matters, dissipation factor, glass transition temperature, percent of thermal expansion in Z-axis, copper foil peeling strength, water absorption ratio and percent of cure shrinkage.