Maleimide Copolymer Adhesive for High-Temperature Semiconductor Processing
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Solution Overview
Problem
Adhesive compositions used in semiconductor processing have low solubility in stripping solutions, leading to decreased adhesiveness and difficulty in removing residues after high-temperature processing, especially at temperatures above 250°C.
Innovation Solution
A copolymerized adhesive composition containing (meth)acrylic acid esters and a monomer with a maleimide group, which maintains adhesiveness and solubility even at high temperatures, preventing residue stripping and facilitating easy removal after high-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive compositions are used for high-temperature processing (above 250°C), then adhesiveness and heat resistance are improved, but solubility in stripping solutions decreases and residue removal becomes difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific monomers (maleimide group-containing monomer in 1-20 parts by mass, acrylic acid ester in 70-95 parts by mass) to achieve optimal balance between heat resistance and solubility. This compositional parameter optimization allows the adhesive to maintain both high-temperature adhesiveness and stripping solution solubility.
Solution Approach 2:
The patent creates a composite adhesive system by copolymerizing multiple monomer types (maleimide-containing monomer combined with acrylic acid ester and optionally other monomers). This composite polymer structure integrates the heat-resistant properties of maleimide groups with the solubility characteristics of acrylic acid ester segments, resolving the contradiction between heat resistance and solubility.
2Stability of the object's composition
If adhesive compositions are designed for high heat resistance, then stability during high-temperature processing is improved, but ease of removal after processing deteriorates
Solution Approach 1:
The patent optimizes the ratio and type of monomers used in the adhesive composition to achieve the right balance between thermal stability and removability. The specific constraint on maleimide-containing monomer (1-20 parts) and acrylic acid ester (70-95 parts) ensures the adhesive remains stable during processing but can be easily removed afterward.
Solution Approach 2:
The adhesive composition is designed to be temporarily stable during high-temperature processing but can be easily discarded (removed) afterward through stripping solution treatment. The solubility characteristics of the acrylic acid ester segments enable complete removal of the adhesive after it has served its temporary fixation purpose.
3Strength
If conventional adhesive compositions are used, then initial adhesiveness is achieved, but residue stripping becomes difficult after high-temperature exposure
Solution Approach 1:
The patent employs a composite polymer structure combining maleimide-containing monomers with acrylic acid esters to create an adhesive that maintains strong initial bonding while enabling easy residue removal. The synergistic combination of these monomer types provides both the strength needed for initial adhesion and the solubility required for easy stripping after high-temperature processing.
Solution Approach 2:
The patent specifies precise compositional parameters (maleimide-containing monomer: 1-20 parts by mass, acrylic acid ester: 70-95 parts by mass) to optimize the balance between initial adhesiveness and ease of residue removal. This parameter optimization ensures the adhesive meets both the strength requirement for initial bonding and the ease-of-removal requirement after processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition ensures that the adhesive properties are preserved and easily removable after high-temperature exposure, preventing residue formation and improving processing efficiency.
Implementation Method 1
A copolymerized adhesive composition containing (meth)acrylic acid esters and a monomer with a maleimide group
Data Source
AI summary
An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1):wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.