Maleimide Underfill Resin for Stable Semiconductor Bonding
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Solution Overview
Problem
Pre-applied underfill materials using epoxy compounds lack sufficient flux activity for removing oxidized metal layers during semiconductor bonding, leading to poor connection stability and productivity due to the reaction of flux components with epoxy compounds, and the instability of thermal radical initiators in radically polymerizable monomers results in low flux activity and mobility issues.
Innovation Solution
A resin composition containing a maleimide compound combined with organic compounds having acidic sites or acid anhydride sites, such as dehydroabietic acid and tetrahydroabietic acid, which enhances flux activity and stability, along with inorganic fillers like silica for improved thermal conductivity and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flux component is added to an epoxy compound-based underfill material, then metal bonding is improved, but flux activity is lowered due to reaction with the epoxy compound
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by replacing epoxy compounds with maleimide compounds that have different reactivity characteristics. This parameter change allows the flux component to remain active without reacting away, thus maintaining both flux activity and metal bonding quality simultaneously.
Solution Approach 2:
The patent creates a composite resin composition by combining maleimide compounds with specific flux components (carboxylic acids or phenolic compounds) in defined ratios. This composite approach ensures compatibility between the resin and flux components, allowing the flux to effectively remove metal oxides while the maleimide compound provides stable bonding without consuming the flux activity.
2Ease of manufacture
If a thermal radical initiator is used in a radically polymerizable monomer, then polymerization is initiated, but product life is reduced due to instability of the initiator
Solution Approach 1:
The patent changes the chemical composition parameters by replacing thermal radical initiators with photopolymerization initiators. This parameter change transforms the activation mechanism from thermal (unstable) to photonic (stable), allowing the resin composition to maintain long shelf life while still enabling polymerization when exposed to UV light.
Solution Approach 2:
The patent substitutes the thermal activation mechanism with a photopolymerization mechanism. Instead of using heat to initiate polymerization (which requires unstable thermal initiators), the system uses UV light activation with photopolymerization initiators, providing both ease of manufacture and long product life.
3Manufacturing precision
If the pitch between electrodes is reduced, then device performance is improved, but workability deteriorates due to elongated filling time
Solution Approach 1:
The patent introduces dynamic control of the resin composition's flow properties. The composition maintains low viscosity during the filling process to enable rapid flow into fine pitch gaps, then undergoes rapid photopolymerization to lock the filled state. This dynamic behavior allows high-speed filling of reduced-pitch electrodes without sacrificing bonding quality.
Solution Approach 2:
The patent applies preliminary action by pre-coating the resin composition on the chip or substrate before bonding. This pre-application ensures the resin is already in position and in optimal flow state before the bonding process begins, enabling rapid filling of narrow gaps between fine-pitch electrodes without requiring extended filling time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent flux activity, flexibility, and low thermal expansion, ensuring effective removal of oxidized metal layers and stable bonding in semiconductor devices, with enhanced productivity and reliability.
Implementation Method 1
a resin composition for an underfill material, comprising a maleimide compound (A), and at least one selected from the group consisting of an organic compound (B) having an acidic site and an organic compound (C) having an acid anhydride site
Implementation Method 2
inorganic fillers like silica for improved thermal conductivity
Implementation Method 3
excellent flux activity, flexibility, and low thermal expansion
Data Source
AI summary
The present invention provides a resin composition containing a maleimide compound (A), and at least one selected from the group consisting of an organic compound (B) having an acidic site and an organic compound (C) having an acid anhydride site.