Double Seal Ring Mandrel Fin Layout for Multi-Die Protection
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Solution Overview
Problem
Existing seal ring structures and fabrication methods in semiconductor technologies are inadequate for forming double seal rings based on chip architecture, which affects the protection and interconnectivity of IC dies.
Innovation Solution
The implementation of a double seal ring structure comprising an outer seal ring enclosing multiple inner seal rings, where each inner seal ring surrounds a circuit region and can be selectively opened or closed depending on chip architecture, along with fin structures and corner stress relief structures for enhanced mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single seal ring structure is used, then the fabrication process is simple, but the protection capability for different chip architectures is insufficient
Solution Approach 1:
The seal ring is divided into multiple independent segments (first seal ring portion and second seal ring portion) that can be selectively formed or opened based on chip architecture requirements. This segmentation allows the structure to provide enhanced protection when needed while maintaining fabrication simplicity when not required.
Solution Approach 2:
The seal ring structure is made dynamic by allowing selective formation of different seal ring portions based on the specific chip architecture. The structure can be configured as complete or partial seals, enabling adaptation to different protection requirements without requiring completely different designs for each application.
2Reliability
If double seal rings are formed for all chip architectures, then protection is enhanced, but manufacturing complexity and cost increase
Solution Approach 1:
The double seal ring structure is applied locally only where needed based on specific chip architecture requirements. The first and second seal ring portions can be selectively formed in different regions, providing enhanced protection at critical locations while avoiding unnecessary complexity in other areas.
Solution Approach 2:
The seal ring structure is designed to serve multiple functions: it can provide full double seal protection for high-reliability applications, single seal for standard applications, or selective opening for interconnect access. This multi-functionality allows a single design framework to handle diverse chip architecture requirements.
3Reliability
If inner seal rings are fully closed, then individual die protection is maximized, but interconnectivity between circuit regions is blocked
Solution Approach 1:
The inner seal rings are designed to be dynamic, allowing selective opening in specific regions to enable interconnects between circuit regions while maintaining closed seals in other areas for protection. This dynamic configuration allows the structure to adapt to different architectural needs.
Solution Approach 2:
The inner seal rings are segmented into regions that can be independently opened or closed. This segmentation allows specific portions to be opened for interconnect access while other portions remain closed to provide protection, enabling both connectivity and protection simultaneously.
Data Source
AI summary
A semiconductor structure includes two circuit regions and two inner seal rings, each of which surrounds one of the circuit regions. Each inner seal ring has a substantially rectangular periphery with four interior corner stress relief (CSR) structures. The semiconductor structure further includes an outer seal ring surrounding the two inner seal rings. The outer seal ring has a substantially rectangular periphery without CSR structures at four interior corners of the outer seal ring. The outer seal ring includes a plurality of first fin structures located between each of the two inner seal rings and a respective short side of the outer seal ring. Each first fin structure is parallel with the respective short side of the outer seal ring. Lengths of the first fin structures gradually decrease along a direction from the inner seal rings to the respective short side of the outer seal ring.