Manifold Element Cooling Multiple Heat Generating Components
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Solution Overview
Problem
Existing cooling systems for heat-generating components, such as computer processors, often require complex setups and multiple connections to manage varying heat removal requirements, which can complicate the cooling process and increase costs.
Innovation Solution
A manifold element with interdigitated inlet and outlet channels on its upper surface is used to control the flow of a cooling fluid, allowing it to match the specific heat removal requirements of each component by adjusting flow restrictions, enabling efficient cooling of multiple components with a single fluid flow path, either in series or parallel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate cooling connections are used for each heat generating component, then each component can be cooled according to its specific heat removal requirement, but the system complexity and number of connections increase
Solution Approach 1:
The patent combines multiple cooling connections into a single manifold element that distributes cooling fluid to multiple heat generating components through integrated inlet and outlet channels. This merging approach maintains the ability to cool each component according to its specific heat removal requirements while reducing the total number of external connections needed.
Solution Approach 2:
The manifold element serves multiple functions simultaneously: it distributes cooling fluid to multiple components, provides flow restrictions for each component, and collects cooled fluid from all components through a single integrated structure. This multi-functionality eliminates the need for separate cooling systems for each component.
2Device complexity
If a single cooling fluid flow path is used for multiple components, then the system complexity is reduced, but it becomes difficult to meet different heat removal requirements of each component
Solution Approach 1:
The manifold element incorporates local flow restrictions at each outlet channel that can be individually adjusted to match the specific heat removal requirements of each heat generating component. This local customization within a unified structure allows each component to receive the appropriate cooling flow rate while maintaining a single external fluid connection.
Solution Approach 2:
The flow restrictions in the manifold element can be dynamically adjusted or designed with varying characteristics to accommodate different heat removal demands of various components. This dynamic adaptability enables a single flow path to serve multiple components with diverse cooling requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the cooling process by allowing multiple heat-generating components to be cooled efficiently with a single inlet and outlet connection, accommodating different heat removal requirements while reducing complexity and costs, and can be tailored to specific components using standardized cavity arrangements and thermally insulating materials.
Implementation Method 1
the cooling fluid may remove heat from the heat generating component while flowing across the upper surface portion of the manifold element
Implementation Method 2
The cooling fluid flows through the tubing unit to circulate from the condenser chamber to the heat absorbing unit by gravity and from the heat-absorbing unit to the condenser chamber by natural convection
Implementation Method 3
The cover is adapted to exchange heat with external cold air so as to condense the working fluid in the condenser chamber
Implementation Method 4
condense the working fluid in the condenser chamber
Data Source
Figure 1
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Figure 5~6
AI summary
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.