Integrated Manifold Fluid Module for Compact EV Heat Pump Flow

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Solution Overview

Problem

Current electric vehicle heat pump systems suffer from increased costs, weight, and performance degradation due to incomplete modularity and integration of components, leading to unnecessary flow distance and thermal interference during cooling and heating modes.

Innovation Solution

A manifold fluid module integrating a manifold plate with internal fluid passages, coupled heat exchangers, and clustered valves to control fluid expansion and direction, optimizing fluid flow from top to bottom and separating high- and low-temperature regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If components are connected by piping with separate fittings and connectors, then assembly flexibility is improved, but device complexity and cost increase

Engineering Contradiction:
Improveassembly flexibilityVSAvoidnumber of fittings and connectors
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent integrates multiple components (heat exchangers, valves, accumulators, sensors) directly onto a common manifold plate, eliminating the need for separate piping and fittings. This merging of components reduces the number of parts, simplifies assembly, and lowers cost while maintaining manufacturing flexibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The manifold plate serves multiple functions simultaneously: it acts as a structural support, a fluid distribution manifold, a mounting platform for components, and a thermal management element. This multi-functionality reduces the overall system complexity by replacing multiple specialized parts with a single integrated structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If components are integrated into a single unit, then device complexity is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvenumber of componentsVSAvoidintegration precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The system is segmented into modular components that are separately manufactured and then precisely assembled onto the manifold plate. This allows each component to be optimized and manufactured independently with standard tolerances, while the overall integration precision is achieved through standardized mounting interfaces and fixtures during assembly.

Inventive Principle:
Principle #1Segmentation

3Volume of moving object

If cooling and heating components are placed close together, then packaging space is optimized, but thermal interference increases

Engineering Contradiction:
Improvepackaging spaceVSAvoidthermal interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The manifold plate incorporates localized thermal insulation barriers and thermally isolating material layers at specific positions where cooling and heating circuits are in close proximity. This allows the system to achieve compact packaging while preventing unwanted thermal interference through localized thermal management at critical interfaces.

Inventive Principle:
Principle #3Local quality

4Productivity

If fluid flow path is shortened for mode transition, then productivity is improved, but component integration becomes more difficult

Engineering Contradiction:
Improvemode transition efficiencyVSAvoidintegration difficulty
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The manifold plate is pre-designed with multiple fluid flow paths and integrated components positioned to enable direct transitions between cooling and heating modes. The flow paths include pre-positioned ports, channels, and connection points that allow the refrigerant to switch modes without backflow or unnecessary travel, with all integration details planned and prepared in advance during the manifold plate manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces costs and weight while improving workability and heat pump performance by minimizing thermal interference and optimizing packaging.

Implementation Method 1

a first heat exchanger coupled to the manifold plate and configured to exchange heat between a first fluid and a second fluid, a second heat exchanger coupled to the manifold plate configured to exchange heat between the first fluid discharged from the first heat exchanger and the second fluid

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20250242666A1Manifold fluid module
Publication Date: 2025.07.31 HANON SYST CO LTD
  • US20250242666A1 patent drawing
  • US20250242666A1 patent drawing
  • US20250242666A1 patent drawing

AI summary

The present invention relates to a manifold fluid module. A manifold fluid module according to an embodiment of the present invention may include a manifold plate comprising fluid passages formed internally, a first heat exchanger coupled to the manifold plate and configured to exchange heat between a first fluid and a second fluid, a second heat exchanger coupled to the manifold plate configured to exchange heat between the first fluid discharged from the first heat exchanger and the second fluid, and a plurality of valves configured to control expansion or direction of the first fluid entering the first heat exchanger or the second heat exchanger, wherein the plurality of valves may be clustered on an upper part of the manifold plate.