Manifold Fluid Module Layout for Thermal Interference Isolation

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Solution Overview

Problem

Current electric vehicle heat pump systems experience performance degradation due to thermal interference between high-temperature and low-temperature fluids, which is exacerbated by the modularization approach requiring separate fittings and connectors, leading to packaging and cost issues.

Innovation Solution

A manifold fluid module with a heat exchanger and fluid passages on a manifold plate, where a separate fluid pipe isolates high-temperature fluid flow from low-temperature fluid passages, minimizing thermal interference through strategic placement and use of an air insulation layer to prevent direct heat conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If components are modularized with separate fittings and connectors, then ease of manufacture and assembly are improved, but thermal interference between high-temperature and low-temperature fluids increases

Engineering Contradiction:

ImprovemodularizationVSAvoidthermal interference

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The manifold is divided into separate high-temperature and low-temperature fluid passages with physical spacing and thermal insulation barriers between them. This segmentation allows modular assembly while preventing thermal interference by creating distinct thermal zones within the integrated manifold structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A thermal insulation barrier or air gap is introduced as an intermediary element between the high-temperature and low-temperature fluid passages. This intermediary prevents direct thermal conduction while maintaining the integrated manifold structure, resolving the contradiction between modularization benefits and thermal interference prevention.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If components are integrated into a single unit, then packaging space and cost are reduced, but thermal interference between high-temperature and low-temperature fluids occurs

Engineering Contradiction:

Improvepackaging spaceVSAvoidthermal interference

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The high-temperature and low-temperature fluid passages are nested within the same manifold body in a compact arrangement. By nesting the passages with appropriate spacing and insulation, the design achieves space efficiency while preventing thermal interference through the insulating barriers between nested passages.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Thin thermal insulation films or coatings are applied to the surfaces of fluid passages that are in close proximity. This allows the manifold to maintain a compact integrated structure while the thin insulating films prevent thermal interference between adjacent high-temperature and low-temperature passages.

Inventive Principle:

Principle #30Flexible shells and thin films

3Device complexity

If high-temperature and low-temperature fluid passages are placed close together, then device complexity is reduced, but temperature variation and performance degradation increase

Engineering Contradiction:

Improvefluid passage arrangementVSAvoidtemperature variation

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

Different regions of the manifold are designed with different thermal insulation characteristics. Areas where high-temperature and low-temperature passages are in close proximity receive enhanced insulation treatment, while other regions can have simpler configurations. This local differentiation maintains low device complexity overall while preventing temperature variation at critical interfaces.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat exchange performance by reducing thermal interference, improving the efficiency and reducing the temperature variation between fluid passages, thereby enhancing the overall performance of the heat pump system.

Implementation Method 1

a heat exchanger coupled to the manifold plate, configured to exchange heat between a first fluid and a second fluid

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

use of an air insulation layer to prevent direct heat conduction

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20250102230A1Manifold fluid module

Publication Date: 2025.03.27 HANON SYST CO LTD

AI summary

The present invention relates to a manifold fluid module. A manifold fluid module according to an embodiment of the present invention may include a manifold plate comprising a fluid passage formed internally, and a heat exchanger coupled to the manifold plate, configured to exchange heat between a first fluid and a second fluid, and comprising a first inlet port for inlet of the first fluid, a first outlet port for outlet of the first fluid, a second inlet port for inlet of the second fluid, and a second outlet port for outlet of the second fluid, wherein the first inlet port and the first outlet port of the heat exchanger may connected to communicate with the fluid passage, one of the first inlet port or the outlet port being directly connected to the manifold plate, the other being connected to a fluid pipe.