Manipulator Arm Conductivity Testing for IC Crack Detection
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Solution Overview
Problem
Existing crack detection methods in integrated circuit manufacturing are complex and reduce manufacturing throughput, as they require specialized testing fixtures and processes, which do not effectively prevent all cracks from propagating from the periphery to the integrated circuit region.
Innovation Solution
A method involving a manipulator arm system that performs conductivity tests on a crack detector via chain to determine if cracks have propagated through the die seal ring into the integrated circuit region, allowing for efficient detection and sorting of defective dies during both front end and back end fabrication processes, thereby reducing manufacturing complexity and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If specialized testing fixtures and processes are used for crack detection, then measurement precision is improved, but device complexity increases and productivity decreases
Solution Approach 1:
The patent extracts the crack detection function from complex specialized testing fixtures and integrates it into the existing manipulator arm system. The crack detector is incorporated into the manipulator arm that handles the die, allowing crack detection to be performed during normal die handling operations without requiring separate complex testing equipment.
Solution Approach 2:
The manipulator arm is given multiple functions: it performs die handling operations and simultaneously performs crack detection. By integrating the crack detector into the manipulator arm, the same device serves both mechanical manipulation and electrical testing purposes, eliminating the need for separate specialized testing fixtures.
2Measurement precision
If specialized testing fixtures and processes are used for crack detection, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The patent merges the crack detection process with the die handling process. The manipulator arm performs both the mechanical task of picking up and transferring the die and the electrical task of testing for cracks, combining two previously separate operations into one integrated process that maintains manufacturing throughput.
Solution Approach 2:
The crack detection is performed continuously during the die handling operation without interrupting the manufacturing flow. The manipulator arm tests each die as it picks it up and transfers it, maintaining continuous productive action rather than requiring separate stopping points for testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies crack detection, reduces manufacturing complexity, and increases throughput by integrating crack testing into the die handling process, ensuring that only crack-free dies are processed for packaging, thus enhancing the overall manufacturing yield.
Implementation Method 1
applying pressure from the second manipulator arm to the given integrated circuit due such that pogo pins extending from the tip of the first manipulator arm make electrical contact with conductive areas of the given integrated circuit die for making an electrical connection to a crack detector on the given integrated circuit die
Data Source
AI summary
A method of testing an integrated circuit die (IC) for cracks includes performing an assembly process on a wafer including multiple ICs including: lowering a tip of a first manipulator arm to contact and pick up a given IC, flipping the given IC such that a surface of the IC facing the wafer faces a different direction, and transferring the IC to a tip of a second manipulator arm, applying pressure from the second manipulator arm to the given IC such that pogo pins extending from the tip of the first manipulator arm make electrical contact with conductive areas of the IC for connection to a crack detector on the IC, and performing a conductivity test on the crack detector using the pogo pins. If the conductivity test indicates a lack of presence of a crack, then the second manipulator arm is used to continue processing of the given IC.