Marangoni Drying Device for Semiconductor Wafer Processing
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Solution Overview
Problem
Conventional drying processes in semiconductor technology, such as those using IPA vapor, face challenges in controlling the amount of IPA used and often result in residual metal contamination and unstable drying, making it difficult to meet specifications and increasing costs.
Innovation Solution
A method and device that utilize a Marangoni effect-based drying process by forming a continuous surface layer of a surface tension-reducing organic compound, like IPA, over a host liquid without evaporation, allowing for better control and reduced contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IPA vapor is used for drying the carrier, then the carrier can be dried without generating drying residues, but the amount of IPA used cannot be precisely controlled and metal contamination occurs
Solution Approach 1:
The invention changes the physical state of IPA from vapor to liquid, and introduces it through a controlled liquid delivery system rather than vapor generation. This parameter change enables precise control of IPA quantity and eliminates the metal contamination associated with vapor generation systems.
Solution Approach 2:
The invention uses a liquid intermediary system (syringe or pump) to deliver IPA in a controlled manner. This intermediary mechanism allows precise dosing and placement of IPA, replacing the uncontrolled vapor phase approach and preventing metal contamination while maintaining effective drying.
2Productivity
If alcohol vapor is blown over the wet surface of the carrier, then the carrier can be dried, but the process is unstable and difficult to control
Solution Approach 1:
The invention performs preliminary action by precisely positioning and depositing a controlled amount of liquid IPA onto the carrier surface before the drying process begins. This pre-positioning ensures stable and reproducible drying conditions, eliminating the instability associated with blowing vapor over the surface.
Solution Approach 2:
The invention replaces the mechanical blowing system with a liquid delivery system (syringe or pump) that deposits IPA directly onto the carrier. This substitution provides more precise control and stability compared to the mechanical vapor blowing approach.
3Manufacturing precision
If deionized water is used to wash the carrier, then precipitates can be removed, but drying residues may remain on the carrier surface
Solution Approach 1:
The invention utilizes the phase transition of water from liquid to vapor, and introduces liquid IPA that evaporates to leave no residues. The controlled evaporation of liquid IPA replaces the problematic drying phase of water, eliminating drying residues while maintaining cleaning quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control of the IPA layer, reduces metal and particle contamination, and minimizes watermarks on the wafer, improving the quality of semiconductor processing while reducing costs and technical effort.
Implementation Method 1
forming a continuous surface layer of a surface tension-reducing organic compound, like IPA, over a host liquid
Implementation Method 2
A method and device that utilize a Marangoni effect-based drying process by forming a continuous surface layer of a surface tension-reducing organic compound
Data Source
AI summary
A processing device including: a chamber to accommodate at least one carrier in a processing region of the chamber, an inlet structure disposed over the chamber, the inlet structure providing a merging region fluidly connected to the processing region, a first liquid control arrangement coupled at least to the chamber, the first liquid control arrangement configured to provide a first liquid in the processing region of the chamber and to raise a level of the first liquid into the merging region of the inlet structure, and a second liquid control arrangement coupled to the inlet structure, the second liquid control arrangement configured to introduce a second liquid in the merging region, wherein the first liquid control arrangement is further configured to drain the first liquid from the chamber to form a continuous surface layer of the second liquid on the first liquid and to expose the at least one carrier.