Mark Segmentation for Semiconductor Alignment Precision
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Solution Overview
Problem
As semiconductor structure sizes decrease, alignment of marks and layered structures becomes increasingly difficult due to the lack of defined relationships between mark width, space, segment width, and segment space, leading to potential shifts and misalignment.
Innovation Solution
A mark segmentation method where the width of marks (WM) is adjusted to be equal to m(WS+SS)+WS or m(WS+SS)+SS, and the space between marks (SM) is set such that WM+SM equals n(WS+SS), with m and n being integers, to ensure accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor structure sizes are reduced, then device integration density is improved, but alignment precision between marks and layered structures deteriorates
Solution Approach 1:
The patent changes the dimensional parameters of marks by defining their width WM and space SM as integer multiples of the segment pattern pitch (WS+SS). Specifically, WM = m(WS+SS) and SM = n(WS+SS) where m and n are integers. This parameter relationship ensures that marks remain proportionally scaled with segments even as overall structure sizes decrease, maintaining alignment precision across different device size scales.
2Ease of manufacture
If mark width and space are not defined with specific relationships, then manufacturing flexibility is improved, but alignment reliability deteriorates
Solution Approach 1:
The patent establishes specific mathematical relationships between mark dimensions and segment dimensions through integer multiples. The mark width WM = m(WS+SS) and mark space SM = n(WS+SS) create a standardized parameter system that ensures reliable alignment while maintaining manufacturing flexibility through the choice of different integer values for m and n.
Solution Approach 2:
The patent segments the mark structure into discrete units defined by the segment pitch (WS+SS). By defining mark width and space as integer multiples of this basic unit, the mark becomes a segmented structure that inherently aligns with the segment pattern, ensuring alignment reliability while allowing flexible configuration through different integer combinations.
Data Source
AI summary
In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.